Skip to main content
SpringerLink
Log in

The composition and microstructure of electrodeposited solder on electroless nickel in the presence of gelatine

  • Papers
  • Published:
Journal of Materials Science Aims and scope Submit manuscript

Abstract

The effect of gelatine addition to the electrodeposition bath on the tin content of the solder deposits was investigated. The results showed that as little as 0.5 gl−1 gelatine greatly enhanced the tin content of the deposits. The maximum tin content achievable for the deposit was approximately equal to the percentage of tin in the deposition bath. A lower current density and a greater metal content of the deposition bath tended to offset the effect of gelatine in promoting tin content of the deposit. Gelatine was found, with the aid of scanning electron microscopy and X-ray diffractometry, strongly to affect the morphology and facet orientation of the deposits.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. A. H. Durose and D. M. Hutchison, Plating (May) (1953) 470.

  2. A. K. Graham and H. L. Pinkerton, ibid. (April) (1965) 309.

  3. B. F. Rothschild and D. Sanders, ibid. (December) (1969) 1363.

  4. J. P. Langon, Plating Surf. Finish. (January) (1983) 21.

  5. J. B. Mohler, Iron Age (February) (1952) 139.

  6. D. R. Turner and G. R. Johnson, J. Electrochem. Soc. 109 (1962) 798.

    Article  CAS  Google Scholar 

  7. M. Paunovic and R. Oechslin, Plating (June) (1971) 599.

  8. T. M. Tam, J. Electrochem. Soc. 133 (1986) 1792.

    Article  CAS  Google Scholar 

  9. J. S. Kim, S. I. Pyun and H. G. Lee, Plating Surf. Finish (July) (1989) 50.

  10. I. Rajagopal and K. S. Rajam, Metal Finish. 76 (1978) 43.

    Google Scholar 

  11. P. A. Kohl, Plating Surf. Finish. (August) (1981) 45.

  12. P. A. Kohl, J. Electrochem. Soc. 129 (1982) 1196.

    Article  CAS  Google Scholar 

  13. N. P. Fedot'ev and P. M. Vyacheslavov, Plating (July) (1970) 700.

  14. N. Ibl, Ph. Jaret and F. Stahel, Electrochim. Acta 17 (1972) 733.

    Article  CAS  Google Scholar 

  15. S. Meibur, E. Yeager, A. Kozawa and F. Hovorka, J. Electrochem. Soc. 110 (1963) 190.

    Article  Google Scholar 

  16. C. H. Bamford and R. G. Compton, “Chemical Kinetics” (Elsevier, Amsterdam, 1986).

    Google Scholar 

  17. A. Brenner, “Electrodeposition of Alloys”, Vol. 1 (Academic Press, London, 1963).

    Google Scholar 

  18. T. B. Massalski, J. L. Murray, L. H. Bennett and H. Baker (eds), “Binary Alloy Phase Diagram” (ASM, Metals Park, OH, 1987).

    Google Scholar 

  19. J. O'M. Bockris and G. E. Razumney, “Fundamental Aspects of Electrocrystallization” (Plenum Press, New York, 1967) p. 127.

    Book  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Department of Materials Science and Engineering (29), National Cheng Kung University, 70101, Tainan, Taiwan

    Kwang-Lung Lin & Jieh-Ting Chang

Authors
  1. Kwang-Lung Lin
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Jieh-Ting Chang
    View author publications

    You can also search for this author in PubMed Google Scholar

Rights and permissions

Reprints and permissions

About this article

Cite this article

Lin, KL., Chang, JT. The composition and microstructure of electrodeposited solder on electroless nickel in the presence of gelatine. JOURNAL OF MATERIALS SCIENCE 30, 1879–1883 (1995). https://doi.org/10.1007/BF00351625

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/BF00351625

Keywords

Search

Navigation