Abstract
Experimental results are presented on the maskless metallization of the surface of polyimides. In a certain range of laser parameters (Ar+ and copper-vapor lasers) the surface of polyimides irradiated in the air becomes catalytically active with respect to copper deposition from the solution for electroless copper plating. Copper lines 50–100 μm wide are deposited on the Kapton films with good adherence.
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References
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