References
W. S. Wolfe, H. Chessin, E. Yeager and F. Hovotka, J. Electrochem. Soc. 101 (1954) 500.
C. T. Walker and R. Walker, ibid. 124 (1977) 661.
M. C. Haiso and C. C. Wan, Plating Surf. Finish. 76 (1989)46.
A. Chiba and W. C. Wu, ibid. 79 (1992) 62.
A. Danjanovic, T. H. Scotty and J. o'M. Bockris, J. Electrochem. Soc. 113 (1996) 429.
R. C. Rau, Adv. X-ray Anal. 6 (1962) 191.
D. F. Smith and D. H. Wilkins, Analyt. Chem. 25 (1953)510.
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Wu, WC., Chiba, A. & Nakanishi, K. Effect of deposition in an ultrasonic field on the corrosion of electrode posited copper coatings. J Mater Sci Lett 12, 794–796 (1993). https://doi.org/10.1007/BF00277974
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DOI: https://doi.org/10.1007/BF00277974