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Thermal diffusivity and conductivity of highly filled epoxies as cover materials for microelectronical devices as measured by the heat pulse technique

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Journal of Materials Science Letters

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Authors and Affiliations

  1. Institute of Nonmetallic Materials, Polymer Physics Group, Technical University of Berlin, Englische Str. 20, D-10587, Berlin, Germany

    A. Nyilas, R. Rehme, C. Wyrwich, H. Springer & G. Hinrichsen

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  1. A. Nyilas
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  2. R. Rehme
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  3. C. Wyrwich
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  4. H. Springer
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  5. G. Hinrichsen
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Nyilas, A., Rehme, R., Wyrwich, C. et al. Thermal diffusivity and conductivity of highly filled epoxies as cover materials for microelectronical devices as measured by the heat pulse technique. J Mater Sci Lett 15, 1457–1459 (1996). https://doi.org/10.1007/BF00275305

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  • DOI: https://doi.org/10.1007/BF00275305

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