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Temperature cycling effects between Sn/Pb solder and electroless copper plated AIN substrate

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Abstract

Thermal cycling effects on Sn/Pb solder and electroless Cu-plated AIN substrates are investigated. X-ray diffraction patterns reveal the existence of Cu2O for the electroless Cu-plated AIN after thermal cycling in an environmental chamber. Moisture in the chamber results in the oxidation of electroless plated Cu and fracture takes place at the Cu2O/Cu interface. The oxidation of Cu is also confirmed by Auger depth profile and electrical sheet resistance measurement. For the solder/Cu/AIN system, fracture occurs at the Cu/solder interface. No intermetallic compounds between solder and Cu are found after thermal cycling. Stress resulting from the thermal expansion mismatch is the major cause of loss of adhesion

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Authors and Affiliations

  1. Department of Electronics Engineering and Institute of Electronics, National Chiao Tung University, Hsinchu, Taiwan

    Bi-Shiou Chiou

  2. Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan

    Jiann-Haur Chang & Jenq-Gong Duh

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  1. Bi-Shiou Chiou
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  2. Jiann-Haur Chang
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  3. Jenq-Gong Duh
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Chiou, BS., Chang, JH. & Duh, JG. Temperature cycling effects between Sn/Pb solder and electroless copper plated AIN substrate. J Mater Sci: Mater Electron 6, 375–379 (1995). https://doi.org/10.1007/BF00144637

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  • DOI: https://doi.org/10.1007/BF00144637

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