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The interaction between an interfacial crack and a microcrack under antiplane loading

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Abstract

This article provides a comprehensive theoretical treatment of the interaction between an arbitrarily located and oriented microdefect and a finite interfacial crack under antiplane loading. The analysis is based upon the use of an integral transform method and a self-consistent iterative superposition technique. The closed form expression for the resulting stress intensity factors at the interfacial crack are obtained by solving the appropriate singular integral equations, using Chebyshev polynomials. Typical examples are provided to show the effect of the location and orientation of the microdefect and the material combination upon the stress intensity factor of the interfacial crack.

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Authors and Affiliations

  1. Engineering Mechanics and Design Laboratory, Department of Mechanical Engineering, University of Toronto, M5S 1A4, Ontario, Canada

    X. D. Wang & S. A. Meguid

Authors
  1. X. D. Wang
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  2. S. A. Meguid
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Wang, X.D., Meguid, S.A. The interaction between an interfacial crack and a microcrack under antiplane loading. Int J Fract 76, 263–278 (1996). https://doi.org/10.1007/BF00048290

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  • DOI: https://doi.org/10.1007/BF00048290

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