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Bimaterial plane with elliptic hole under uniform tension normal to the interface

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Abstract

A bimaterial plane subject to uniform tensile traction normal to the interface is analyzed. The plane consists of two dissimilar elastic half-planes each with a semi-elliptic notch. The stress analysis is carried out by using a rational mapping function and complex stress ones. Stress Intensity of Debonding is defined as an index for the stress intensity at the tip of debonding and is investigated. The expression of energy release rate is derived by applying the residue theorem to a contour integral expressed by the complex stress function. Stress distributions around a circular hole and on the interface are shown. Stress concentration factors are studied for various oval shapes, material constants, and debonding lengths. Expressions of stress concentration factor are given.

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Authors and Affiliations

  1. Civil Engineering Department, Technological Central Division, Tokyu Construction Co., Ltd., 1-16-14 Shibuya, Shibuya-ku, 150, Tokyo, Japan

    Mikiya Okumura

  2. Department of Cilvil Engineering, Nagoya Institute of Technology, Gokiso-cho, Showa-ku, 466, Nagoya, Japan

    Norio Hasebe & Takuji Nakamura

Authors
  1. Mikiya Okumura
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  2. Norio Hasebe
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  3. Takuji Nakamura
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Mikiya, O., Hasebe, N. & Nakamura, T. Bimaterial plane with elliptic hole under uniform tension normal to the interface. Int J Fract 71, 293–310 (1995). https://doi.org/10.1007/BF00037811

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  • DOI: https://doi.org/10.1007/BF00037811

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