Abstract
The problem of thin plate bending of two bonded dissimilar half-planes containing an elliptical hole on the interface with debonding emanating on both sides is presented. The external load is a uniformly distributed bending moment applied at infinity perpendicular to the interface. An analytical solution is obtained using the complex stress function approach and the rational mapping function technique. Stress distributions on the interface, the boundaries of the hole and in the vicinity of the debonded tips are obtained. The stress intensity of debonding is obtained for aribitrary lengths of debonding, all possible hole dimensions and rigidity ratios.
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Salama, M., Hasebe, N. Thin plate bending of dissimilar half-planes with interface debonding emanating from an elliptical hole. Int J Fract 74, 199–218 (1996). https://doi.org/10.1007/BF00033828
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DOI: https://doi.org/10.1007/BF00033828