Copper nanowires (CuNWs), as one-dimensional nanostructures, could be highly helpful as thermal management tools because of inherent thermal conductivity, high aspect ratio, and low cost. In this study, boron nitride-coated copper nanowires (CuNWs@BN) were successfully synthesized by an amenable and rapid technique and incorporated into synthetic polyimide (PI) to increase thermal conductivity while providing electrical insulation to nanocomposites. Maximal thermal conductivity in CuNWs@BN/PI composites containing fillers loading up to 20% volume rose to 4.12 W/mK, indicating an amelioration of 23 times in comparison with that of pure PI, while volume resistivity remained greater than 4.8 × 1013 Ω cm. Such nanocomposites with high thermal conductivity and electrical insulation could constitute important tools for thermal management.
This is a preview of subscription content, log in to check access.
We would like to thank the Analytical & Testing Center of Northwestern Polytechnical University for their equipment supporting.
This study was supported by the National Natural Science Foundation of China (51707159), the Natural Science Foundation of Shaanxi Province (2017JM5073), the State Key Laboratory of Electrical Insulation and Power Equipment (EIPE17205), and the Fundamental Research Funds for the Central Universities (3102017zy047).
Compliance with ethical standards
Conflict of interest
The authors declare that they have no conflict of interest.
Douiri H, Louati S, Baklouti S et al (2016) Enhanced dielectric performance of metakaolin-H3PO4 geopolymers. Mater Lett 164:299–302CrossRefGoogle Scholar
Yin Y, Lu Y, Sun Y et al (2002) Silver nanowires can be directly coated with amorphous silica to generate well-controlled coaxial nanocables of silver/silica. Nano Lett 2(4):427–430CrossRefGoogle Scholar
Moore AL, Shi L (2014) Emerging challenges and materials for thermal management of electronics. Mater Today 17(4):163–174CrossRefGoogle Scholar
Huang XY, Iizuka T, Jiang PK et al (2012) Role of interface on the thermal conductivity of highly filled dielectric epoxy/AlN composites. J Phys Chem C 116(25):13629–13639CrossRefGoogle Scholar
Im H, Kim J (2011) The effect of Al2O3 doped multi-walled carbon nanotubes on the thermal conductivity of Al2O3/epoxy terminated poly(dimethylsiloxane) composites. Carbon 49(11):3503–3511CrossRefGoogle Scholar
Hu JT, Huang Y, Yao YM et al (2017) Polymer composite with improved thermal conductivity by constructing a hierarchically ordered three-dimensional interconnected network of BN. ACS Appl Mater Interfaces 9(15):13544–13553CrossRefGoogle Scholar
Kusunose T, Yagi T, Firoz SH et al (2013) Transition-metal nitride nanoparticles embedded in N-doped reduced graphene oxide: superior synergistic electrocatalytic materials for the counter electrodes of dye-sensitized solar cells. J Mater Chem A 1:3440–3445CrossRefGoogle Scholar
Araby S, Zhang LQ, Kuan HC et al (2013) A novel approach to electrically and thermally conductive elastomers using grapheme. Polymer 54(14):3663–3670CrossRefGoogle Scholar
Shen B, Zhai WT, Zheng WG (2014) Ultrathin flexible graphene film: an excellent thermal conducting material with efficient EMI shielding. Adv Funct Mater 24(28):4542–4548CrossRefGoogle Scholar
Chen HY, Chen MH, Di JT et al (2012) Architecting three-dimensional networks in carbon nanotube buckypapers for thermal interface materials. J Phys Chem C 116(6):3903–3909CrossRefGoogle Scholar
Zhou YC, Yao YG, Chen CY et al (2014) The use of polyimide-modified aluminum nitride fillers in AlN@PI/epoxy composites with enhanced thermal conductivity for electronic encapsulation. Sci Rep 4:4779CrossRefGoogle Scholar
Chang Y, Lye ML, Zeng HC (2005) Large-scale synthesis of high-quality ultralong copper nanowires. Langmuir 21(9):3746–3748CrossRefGoogle Scholar
Ahn K, Kim K, Kim J (2015) Thermal conductivity and electric properties of epoxy composites filled with TiO2-coated copper nanowire. Polymer 76:313–320CrossRefGoogle Scholar
Lee P, Lee J, Lee H et al (2012) Highly stretchable and highly conductive metal electrode by very long metal nanowire percolation network. Adv Mater 24(25):3326–3332CrossRefGoogle Scholar
Wan P, Wu Z, Zhang H et al (2016) Porous nano-SiC as thermal insulator: wisdom on balancing thermal stability, high strength and low thermal conductivity. Mater Res Lett 4(2):104–111CrossRefGoogle Scholar
Wu YM, Ye K, Liu ZD et al (2018) Effective thermal transport highway construction within dielectric polymer composites via a vacuum-assisted infiltration method. J Mater Chem C 6:6494–6501CrossRefGoogle Scholar
Zhou YC, Zhuang X, Wu FX, Liu F (2018) High-performance thermal management nanocomposites: silver functionalized graphene nanosheets and multiwalled carbon nanotube. Crystals 8:398CrossRefGoogle Scholar
Zhou YC, Wu SQ, Liu F (2019) High-performance polyimide nanocomposites with polydopamine- coated copper nanoparticles and nanowires for electronic applications. Mater Lett 237:19–21CrossRefGoogle Scholar
Zhou YC, Liu F, Wang H (2017) Novel organic-inorganic composites with high thermal conductivity for electronic packaging applications: a key issue review. Polym Compos 38:803–813CrossRefGoogle Scholar
Chen HY, Ginzburg VV, Yang J, Yang YF, Liu W, Huang Y, Du LB, Chen B (2016) Thermal conductivity of polymer-based composites: fundamentals and applications. Prog Polym Sci 59:41–85CrossRefGoogle Scholar
Zhou YC, Yu SH, Niu H, Liu F (2018) Synergistic improvement in thermal conductivity of polyimide nanocomposite films using boron nitride coated copper nanoparticles and nanowires. Polymers 10(12):1412CrossRefGoogle Scholar
Tang L, Dang J, He MK, Li JY, Kong J, Tang YS, Gu JW (2019) Preparation and properties of cyanate-based wave-transparent laminated composites reinforced by dopamine/POSS functionalized Kevlar cloth. Compos Sci Technol 169:120–126CrossRefGoogle Scholar