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New thermal optimization scheme of power module in solid-state amplifier

  • Lie-Peng SunEmail author
  • Zhen-Yu Yuan
  • Cheng Zhang
  • Xian-Bo Xu
  • Jun-Gang Miao
  • Jian-Hua Zhang
  • Long-Bo Shi
  • Yuan He
Article
  • 32 Downloads

Abstract

The new 1 kW power module for ADS project needs the optimization of cooling design including water flow and tunnel layout, and the water flow of three tons per hour was chosen to be a goal for a 20 kW power source. According to analysis from the insertion and integrated loss, about 24 modules were integrated into the rated power. Thus, every module has a cooling flow of 2.1 L/min for RF heat load and power supply loss, which is very hard to achieve if no special consideration and techniques. A new thermal simulation method was introduced for thermal analysis of cooling plate through CST multi-physics suite, especially for temperature of power LDMOS transistor. Some specific measures carried out for the higher heat transfer were also presented in this paper.

Keywords

RF system Solid-state amplifier Power module Heat transfer coefficient 

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Copyright information

© China Science Publishing & Media Ltd. (Science Press), Shanghai Institute of Applied Physics, the Chinese Academy of Sciences, Chinese Nuclear Society and Springer Nature Singapore Pte Ltd. 2019

Authors and Affiliations

  • Lie-Peng Sun
    • 1
    Email author
  • Zhen-Yu Yuan
    • 1
  • Cheng Zhang
    • 1
  • Xian-Bo Xu
    • 3
  • Jun-Gang Miao
    • 2
  • Jian-Hua Zhang
    • 1
  • Long-Bo Shi
    • 3
  • Yuan He
    • 3
  1. 1.Beijing BBEF Science and Technology Co., Ltd.BeijingChina
  2. 2.Beihang UniversityBeijingChina
  3. 3.Institute of Modern PhysicsChinese Academy of SciencesLanzhouChina

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