Estimation of Energy Savings When Adopting Ultrasonic Vibration-Assisted Magnetic Compound Fluid Polishing

  • Chen JiangEmail author
  • Jialei Huang
  • Zhenyu Jiang
  • Dabing Qian
  • Xiaolan Hong
Regular Paper


Reducing energy use is a major consideration in green manufacturing. Ultrasonic vibration has the advantage of improving machining performance. This work presents an experimental investigation on magnetic compound fluid (MCF) polishing with and without ultrasonic vibration and estimates reductions in polishing energy consumption and surface roughness due to ultrasonic vibration during the machining process. A series of ultrasonic vibration-assisted MCF polishing (UVAMP) tests was carried out for brass H62, and the normal and tangential polishing forces, surface roughness and material removal rate of the traditional MCF polishing (MP) and UVAMP of brass were investigated for various machining parameters. The polishing energy consumptions during traditional MCF polishing and UVAMP were calculated and analyzed from the perspective of the energy of the polishing process. Results indicate that the use of UVAMP considerably reduces energy consumption and surface roughness during the polishing of brass. The adoption of UVAMP therefore has the potential to improve the efficiency and quality of polishing processes and offers a practical solution for the greener manufacturing of brass.


Energy saving Ultrasonic vibration Magnetic compound fluid Surface roughness 



This work was supported by National Natural Science Foundation of China (51475310).


  1. 1.
    Guo, H., Wu, Y., Lu, D., Fujimoto, M., & Nomura, M. (2014). Effects of pressure and shear stress on material removal rate in ultra-fine polishing of optical glass with magnetic compound fluid slurry. Journal of Materials Processing Technology,214(11), 2759–2769.CrossRefGoogle Scholar
  2. 2.
    Vicente, J. D., Klingenberg, D. J., & Hidalgo-Alvarez, R. (2011). Magnetorheological fluids: A review. Soft Matter, 7(8), 3701.CrossRefGoogle Scholar
  3. 3.
    Guo, H., Wu, Y., Lu, D., Fujimoto, M., & Nomura, M. (2014). Ultrafine polishing of electroless nickel–phosphorus-plated mold with magnetic compound fluid slurry. Materials and Manufacturing Processes, 29(11–12), 1502–1509.CrossRefGoogle Scholar
  4. 4.
    Venkatesh, V. C., Inasaki, I., Toenshof, H. K., Nakagawa, T., & Marinescu, I. D. (1995). Observations on polishing and ultraprecision machining of Semiconductor substrate materials. CIRP Annals-Manufacturing Technology, 44(2), 611–618.CrossRefGoogle Scholar
  5. 5.
    Jiang, C., Wu, T., Ye, H., Cheng, J. Y., & Hao, Y. (2019). Estimation of energy and time savings in optical glass manufacturing when using ultrasonic vibration-assisted grinding. International Journal of Precision Engineering and Manufacturing-Green Technology, 6(1), 1–9.CrossRefGoogle Scholar
  6. 6.
    Mirian, S., Safavi, M., Fadaei, A., Salimi, M., & Farzin, M. (2011). Improving the quality of surface in polishing process with the magnetic abrasive powder polishing (MAPP) by use of ultrasonic oscillation of work-piece on a CNC table. International Journal of Precision Engineering and Manufacturing-Green Technology, 12(2), 275–284.CrossRefGoogle Scholar
  7. 7.
    Wang, H.J. (2007). Technologies of ultrasonic-magnetorheological compound finishing, D. Journal of Harbin Institute of Technology.Google Scholar
  8. 8.
    Kala, P., Kumar, S., & Pandey, P. M. (2013). Polishing of copper alloy using double disk ultrasonic assisted magnetic abrasive polishing. Materials and Manufacturing Processes, 28(2), 200–206.CrossRefGoogle Scholar
  9. 9.
    Kobayashi, N., Wu, Y., Nomura, M., & Sato, T. (2008). Precision treatment of silicon wafer edge utilizing ultrasonically assisted polishing technique. Journal of Materials Processing Technology, 201(1–3), 531–535.CrossRefGoogle Scholar
  10. 10.
    Zhao, Q. L., Sun, Z. Y., & Guo, B. (2017). Ultrasonic vibration—assisted polishing of V-groove arrays on hard and brittle materials. Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, 231(2), 346–354.CrossRefGoogle Scholar
  11. 11.
    Yang, W., Wu, Y., & Kato, M. (2008). A new approach to silicon wafer edge treatment by ultrasonically assisted polishing (UAP). International Journal of Materials and Product Technology, 31(2), 159–175.CrossRefGoogle Scholar
  12. 12.
    Mulik, R. S., & Pandey, P. M. (2011). Ultrasonic assisted magnetic abrasive finishing of hardened AISI 52100 steel using unbonded SiC abrasives. International Journal of Refractory Metals and Hard Materials, 29(1), 68–77.CrossRefGoogle Scholar
  13. 13.
    Hocheng, H., & Kuo, K. L. (2002). Fundamental study of ultrasonic polishing of mold steel. International Journal of Machine Tools and Manufacture, 42(1), 7–13.CrossRefGoogle Scholar
  14. 14.
    Wu, Y. B., & Wang, Y. L. (2014). Nano-precision polishing of CVD SiC using MCF (magnetic compound fluid) slurry. Journal of the Korean Society of Manufacturing Technology Engineers, 23(6), 547–554.CrossRefGoogle Scholar
  15. 15.
    Wang, Y., Wu, Y., & Nomura, M. (2016). Feasibility study on surface finishing of miniature V-grooves with magnetic compound fluid slurry. Precision Engineering, 45, 67–78.CrossRefGoogle Scholar

Copyright information

© Korean Society for Precision Engineering 2019

Authors and Affiliations

  1. 1.School of Mechanical EngineeringUniversity of Shanghai for Science and TechnologyShanghaiChina

Personalised recommendations