Advertisement

Electrical behavior of laser-sintered Cu based metal-organic decomposition ink in air environment and application as current collectors in supercapacitor

  • Jun Ho Yu
  • Yoonsoo Rho
  • Heuiseok Kang
  • Hyun Suk Jung
  • Kyung-Tae Kang
Article

Abstract

Cu based metal-organic decomposition (MOD) ink has been preferred as a printable conductive material in the field of printed electronics because it can mitigate the formation of undesired Cu oxide or precipitation of the metal source during storage and printing. However there will be oxidation of Cu during sintering process in air environment, for fabrication of conductive track from printed ink. In this paper, possibility of laser-sintering of Cu MOD ink in air was studied. The Cu MOD ink was spin-coated on polyimide (PI) substrate. The laser with 355 nm wavelength was accommodated as a heat source in this study. The parametric study with various laser power intensities and scan rates, showed 230-557 W/cm2 and 1-8 mm/s as the feasible laser-sintering process window. As a result, the specific resistance of the laser-sintered Cu MOD ink was achieved 21 μΩcm which was about 10 times as much as that of bulk Cu. As an application, laser-sintered Cu MOD ink was confirmed to give acceptable performances compared to traditional Cu sheet electrodes as flexible current collectors of the supercapacitor.

Keywords

Cu ink Laser sintering Specific resistance Current collector Supercapacitor 

References

  1. 1.
    Sabnis, R. W., “Color Filter Technology for Liquid Crystal Displays,” Displays, Vol. 20, No. 3, pp. 119–129, 1999.MathSciNetCrossRefGoogle Scholar
  2. 2.
    Calvert, P., “Inkjet Printing for Materials and Devices,” Chemistry of Materials, Vol. 13, No. 10, pp. 3299–3305, 2001.CrossRefGoogle Scholar
  3. 3.
    Arias, A., Ready, S., Lujan, R., Wong, W., Paul, K., et al., “All Jet- Printed Polymer Thin-Film Transistor Active-Matrix Backplanes,” Applied Physics Letters, Vol. 85, No. 15, pp. 3304–3306, 2004.CrossRefGoogle Scholar
  4. 4.
    Lee, S., Shin, K., Hwang, J., Kang, K., and Kang, H., “Silver Inkjet Printing with Control of Surface Energy and Substrate Temperature,” Journal of Micromechanics and Microengineering, Vol. 18, No. 7, Paper No. 07504, 2008.Google Scholar
  5. 5.
    Rahman, K., Khan, A., Nam, N. M., Choi, K. H., and Kim, D.-S., “Study of Drop-on-Demand Printing through Multi-Step Pulse Voltage,” Int. J. Precis. Eng. Manuf., Vol. 12, No. 4, pp. 663–669, 2011.CrossRefGoogle Scholar
  6. 6.
    Jeong, S., Woo, K., Kim, D., Lim, S., Kim, J. S., et al., “Controlling the Thickness of the Surface Oxide Layer on Cu Nanoparticles for the Fabrication of Conductive Structures by Ink-Jet Printing,” Advanced Functional Materials, Vol. 18, No. 5, pp. 679–686, 2008.CrossRefGoogle Scholar
  7. 7.
    Seong, M.-R., Lee, G.-Y., Kim, D.-K., Kim, Y.-S., and Lee, C. S., “Octanethiol Coating of Nano-Sized Copper Powders Using the Vapor Self-Assembled Monolayer Method,” Metals and Materials International, Vol. 15, No. 6, pp. 963–966, 2009.CrossRefGoogle Scholar
  8. 8.
    Yabuki, A., Arriffin, N., and Yanase, M., “Low-Temperature Synthesis of Copper Conductive Film by Thermal Decomposition of Copper-Amine Complexes,” Thin Solid Films, Vol. 519, No. 19, pp. 6530–6533, 2011.CrossRefGoogle Scholar
  9. 9.
    Lee, Y.-I., Lee, K.-J., Goo, Y.-S., Kim, N.-W., Byun, Y., et al., “Effect of Complex Agent on Characteristics of Copper Conductive Pattern Formed by Ink-Jet Printing,” Japanese Journal of Applied Physics, Vol. 49, No. 8R, Paper No. 08651, 2010.Google Scholar
  10. 10.
    Shin, D.-H., Woo, S., Yem, H., Cha, M., Cho, S., et al., “A Self- Reducible and Alcohol-Soluble Copper-Based Metal-Organic Decomposition Ink for Printed Electronics,” ACS Applied Materials & Interfaces, Vol. 6, No. 5, pp. 3312–3319, 2014.CrossRefGoogle Scholar
  11. 11.
    Yabuki, A. and Arriffin, N., “Electrical Conductivity of Copper Nanoparticle Thin Films Annealed at Low Temperature,” Thin Solid Films, Vol. 518, No. 23, pp. 7033–7037, 2010.CrossRefGoogle Scholar
  12. 12.
    Park, B. K., Kim, D., Jeong, S., Moon, J., and Kim, J. S., “Direct Writing of Copper Conductive Patterns by Ink-Jet Printing,” Thin Solid Films, Vol. 515, No. 19, pp. 7706–7711, 2007.CrossRefGoogle Scholar
  13. 13.
    Joo, M., Lee, B., Jeong, S., and Lee, M., “Comparative Studies on Thermal and Laser Sintering for Highly Conductive Cu Films Printable on Plastic Substrate,” Thin Solid Films, Vol. 520, No. 7, pp. 2878–2883, 2012.CrossRefGoogle Scholar
  14. 14.
    Yu, J. H., Hwang, J. Y., Lee, S. H., Kang, H., and Kang, K. T., “Rapid Sintering of Copper Nano Ink Using a Laser in Air,” Int. J. Precis. Eng. Manuf., Vol. 15, No. 6, pp. 1051–1054, 2014.CrossRefGoogle Scholar
  15. 15.
    Zenou, M., Ermak, O., Saar, A., and Kotler, Z., “Laser Sintering of Copper Nanoparticles,” Journal of Physics D: Applied Physics, Vol. 47, No. 2, Paper No. 02551, 2014.CrossRefGoogle Scholar
  16. 16.
    Han, W. S., Hong, J. M., Kim, H. S., and Song, Y. W., “Multi- Pulsed White Light Sintering of Printed Cu Nanoinks,” Nanotechnology, Vol. 22, No. 39, Paper No. 39575, 2011.CrossRefGoogle Scholar
  17. 17.
    Lee, J., Lee, B., Jeong, S., Kim., Y., and Lee, M., “Enhanced Surface Coverage and Conductivity of Cu Complex Ink-Coated Films by Laser,” Applied Surface Science, Vol. 307, pp. 42–45, 2014CrossRefGoogle Scholar
  18. 18.
    Lee, J., Lee, B., Jeong, S., Kim, Y., and Lee, M., “Microstructure and Electrical Property of Laser-Sintered Cu Complex Ink,” Thin Solid Films, Vol. 564, pp. 264–268, 2014.CrossRefGoogle Scholar
  19. 19.
    Galwey, A. K., Jamieson, D. M., and Brown, M. E., “Thermal Deconiposition of Three Crystalline Modifications of Anhydrous Copper (II) Formate,” The Journal of Physicill Chernistry, Vol. 78, No. 26, pp. 2664–2670, 1974.CrossRefGoogle Scholar
  20. 20.
    Chou, K. S., Huang, K. C., and Lee, H. H., “Fabrication and Sintering Effect on the Morphologies and Conductivity of Nano-Ag Particle Films by the Spin Coating Method,” Nanotechnology, Vol. 16, No. 6, pp. 779–784, 2005.CrossRefGoogle Scholar
  21. 21.
    Chen, W., Rakhi, R., Hu, L., Xie, X., Cui, Y., et al., “High- Performance Nanostructured Supercapacitors on a Sponge,” Nano Letters, Vol. 11, No. 12, pp. 5165–5172, 2011.CrossRefGoogle Scholar
  22. 22.
    Chen, J., Li, W., Wang, D., Yang, S., Wen, J., and Ren, Z., “Electrochemical Characterization of Carbon Nanotubes as Electrode in Electrochemical Double-Layer Capacitors,” Carbon, Vol. 40, No. 8, pp. 1193–1197, 2002.CrossRefGoogle Scholar
  23. 23.
    Tsay, K.-C., Zhang, L., and Zhang, J., “Effects of Electrode Layer Composition/Thickness and Electrolyte Concentration on both Specific Capacitance and Energy Density of Supercapacitor, Electrochimica Acta, Vol. 60, pp. 428–436, 2012.CrossRefGoogle Scholar

Copyright information

© Korean Society for Precision Engineering 2015

Authors and Affiliations

  • Jun Ho Yu
    • 1
    • 2
  • Yoonsoo Rho
    • 1
  • Heuiseok Kang
    • 1
  • Hyun Suk Jung
    • 2
  • Kyung-Tae Kang
    • 1
  1. 1.Micro and Nano Process Research GroupKorea Institute of Industrial TechnologyGyeonggi-doSouth Korea
  2. 2.School of Advanced Materials Science and EngineeringSungkyunkwan UniversityGyeonggi-doSouth Korea

Personalised recommendations