Direct ink writing of flexible electronic circuits and their characterization

  • Muhammad Abas
  • Qazi Salman
  • Aqib Mashood Khan
  • Khalid RahmanEmail author
Technical Paper


The present work discusses the fabrication of low-cost, reliable and durable flexible electronic circuits from conductive carbon paste on flexible polyethylene terephthalate (PET) substrate using microdispensing direct ink write technique. Printing parameters such as pressure, substrate speed and gap size are optimized through Box–Behnken experimental design technique to achieve the desired quality of prints (patterns). For the nozzle with an inner diameter of 200 µm, the system is able to produce pattern line width ranging from 198 µm to 295 µm, respectively. Based on optimized parameters, circuits such as foil grid and rectangular spiral are printed on a flexible PET substrate. The deposited patterns of circuits are morphologically characterized by optical microscopy and scanning electronic microscopy. Current–Voltage (IV) characteristic is performed to evaluate the conductive performance of circuits. The sensitivity of circuits to bending is assessed by studying resistance response under fully bend and unbend angle of 90° and 0°. Durability and reliability of circuits are analyzed by subjecting circuits to continuous 500 bend cycles and study its resistance response. The analysis revealed that these direct ink write circuits are reliable, durable and stable in performance and are applicable to the flexible electronic application.


Microdispensing direct ink writing Conductive carbon paste Flexible circuits Polyethylene substrate Box–Behnken 



  1. 1.
    Mortara L, Hughes J, Ramsundar PS et al (2009) Proposed classification scheme for direct writing technologies. Rapid Prototyp J. CrossRefGoogle Scholar
  2. 2.
    Anagnostou DE, Gheethan AA, Amert AK, Whites KW (2010) A direct-write printed antenna on paper-based organic substrate for flexible displays and WLAN applications. IEEE/OSA J Disp Technol. CrossRefGoogle Scholar
  3. 3.
    Parekh DP, Ladd C, Panich L et al (2016) 3D printing of liquid metals as fugitive inks for fabrication of 3D microfluidic channels. Lab Chip. CrossRefGoogle Scholar
  4. 4.
    Gao Y, Li H, Liu J (2013) Directly writing resistor, inductor and capacitor to composite functional circuits: a super-simple way for alternative electronics. PLoS ONE. CrossRefGoogle Scholar
  5. 5.
    Chen B, Jiang Y, Tang X et al (2017) Fully packaged carbon nanotube supercapacitors by direct ink writing on flexible substrates. ACS Appl Mater Interfaces. CrossRefGoogle Scholar
  6. 6.
    Zhou N, Liu C, Lewis JA, Ham D (2017) Gigahertz electromagnetic structures via direct ink writing for radio-frequency oscillator and transmitter applications. Adv Mater. CrossRefGoogle Scholar
  7. 7.
    Numan-Al-Mobin AM, Cross WM, Kellar JJ, Anagnostou DE (2015) RFID integrated QR code tag antenna. In: 2015 IEEE MTT-S international microwave symposium. IEEE, pp 1–3Google Scholar
  8. 8.
    Numan-Al-Mobin AM, Shankar R, Cross WM, Kellar J, Whites KW, Anagnostou DE (2014) Direct-write printing of an RF-MEMS cantilever. In: 2014 IEEE antennas and propagation society international symposium (APSURSI). IEEE, pp 15–16Google Scholar
  9. 9.
    Al-Mobin AMN, Shankar R, Cross W, Kellar J, Whites KW, Anagnostou DE (2014) Advances in direct-write printing of RF-MEMS using M3D. In: 2014 IEEE MTT-S international microwave symposium (IMS2014). IEEE, pp 1–4Google Scholar
  10. 10.
    Abas M, Rahman K (2016) Fabrication of flex sensors through direct ink write technique and its electrical characterization. Appl Phys A Mater Sci Process. CrossRefGoogle Scholar
  11. 11.
    Shakeel M, Khan WA, Rahman K (2017) Fabrication of cost effective and high sensitivity resistive strain gauge using DIW technique. Sens Actuators A Phys. CrossRefGoogle Scholar
  12. 12.
    Church K, Fore C, Feeley T (2000) Commercial applications and review for direct write technologies. In: MRS Proceedings, vol 624. p 3.
  13. 13.
    Hon KKB, Li L, Hutchings IM (2008) Direct writing technology-advances and developments. CIRP Ann Manuf Technol. CrossRefGoogle Scholar
  14. 14.
    Li B, Clark PA, Church KH (2007) Robust direct-write dispensing tool and solutions for micro/meso-scale manufacturing and packaging. ASME IEEE Int Manuf Sci Eng Conf. CrossRefGoogle Scholar
  15. 15.
    Lewis JA (2006) Direct ink writing of 3D functional materials. Adv Funct Mater. CrossRefGoogle Scholar
  16. 16.
    Bruneaux J, Therriault D, Heuzey MC (2008) Micro-extrusion of organic inks for direct-write assembly. J Micromech Microeng. CrossRefGoogle Scholar
  17. 17.
    Morissette SL, Lewis JA, Clem PG et al (2001) Direct-write fabrication of Pb(Nb, Zr, Ti)O3 devices: influence of paste rheology on print morphology and component properties. J Am Ceram Soc. CrossRefGoogle Scholar
  18. 18.
    Smay JE, Cesarano J, Lewis JA (2002) Colloidal inks for directed assembly of 3-D periodic structures. Langmuir. CrossRefGoogle Scholar
  19. 19.
    Safari A (2001) Processing of advanced electroceramic components by fused deposition technique. Ferroelectr 263(1):45–54CrossRefGoogle Scholar
  20. 20.
    Zhang Y, Liu C, Whalley D (2009) Direct-write techniques for maskless production of microelectronics: a review of current state-of-the-art technologies. In: 2009 international conference on electronic packaging technology and high density packaging, ICEPT-HDP 2009Google Scholar
  21. 21.
    Farooq U, Khan I, Ahmad S, Abas M, Khan MAZ, Rahman K (2019) Fabrication of PEDOT: PSS conductive patterns on photo paper substrate through electro-hydrodynamic jet printing process. Int J Lightweight Mater Manuf. CrossRefGoogle Scholar
  22. 22.
    Goth C, Putzo S, Franke J (2011) Aerosol jet printing on rapid prototyping materials for fine pitch electronic applications. In: Proceedings—electronic components and technology conferenceGoogle Scholar
  23. 23.
    Cummins G, Desmulliez MPY (2012) Inkjet printing of conductive materials: a review. Circuit World 38(4):193–213CrossRefGoogle Scholar
  24. 24.
    Ahn BY, Lorang DJ, Lewis JA (2011) Transparent conductive grids via direct writing of silver nanoparticle inks. Nanoscale. CrossRefGoogle Scholar
  25. 25.
    Kondo A, Abe H, Naito M (2010) Ceramic nanoparticle ink for direct colloidal assembly. Trans JWRI 39(1):81–83Google Scholar
  26. 26.
    Ahn BY, Duoss EB, Motala MJ et al (2009) Omnidirectional printing of flexible, stretchable, and spanning silver microelectrodes. Science (80-). CrossRefGoogle Scholar
  27. 27.
    Ahn BY, Walker SB, Slimmer SC et al (2011) Planar and three-dimensional printing of conductive inks. J Vis Exp. CrossRefGoogle Scholar
  28. 28.
    Kadara RO, Jenkinson N, Li B et al (2008) Manufacturing electrochemical platforms: direct-write dispensing versus screen printing. Electrochem Commun. CrossRefGoogle Scholar
  29. 29.
    Cao Y, Zhou L, Wang X et al (2009) MicroPen direct-write deposition of polyimide. Microelectron Eng. CrossRefGoogle Scholar
  30. 30.
    Skotadis E, Tang J, Tsouti V, Tsoukalas D (2010) Chemiresistive sensor fabricated by the sequential ink-jet printing deposition of a gold nanoparticle and polymer layer. Microelectron Eng. CrossRefGoogle Scholar
  31. 31.
    Li WT, Hei YQ, Grubb PM et al (2018) Inkjet printing of wideband stacked microstrip patch array antenna on ultrathin flexible substrates. IEEE Trans Compon Packag Manuf Technol. CrossRefGoogle Scholar
  32. 32.
    Zhao D, Liu T, Zhang M et al (2012) Fabrication and characterization of aerosol-jet printed strain sensors for multifunctional composite structures. Smart Mater Struct. CrossRefGoogle Scholar
  33. 33.
    Dingeldein JC, Walczak KA, Swatowski BW et al (2013) Process characterization for direct dispense fabrication of polymer optical multi-mode waveguides. J Micromech Microeng. CrossRefGoogle Scholar
  34. 34.
    Turner BN, Gold SA (2015) A review of melt extrusion additive manufacturing processes: II. Materials, dimensional accuracy, and surface roughness. Rapid Prototyp. J 21(3):250–261CrossRefGoogle Scholar
  35. 35.
    Kim DH, Ryu SS, Shin D et al (2012) The fabrication of front electrodes of Si solar cell by dispensing printing. Mater Sci Eng B Solid-State Mater Adv Technol. CrossRefGoogle Scholar
  36. 36.
    Papanastasiou TC, Georgiou GC, Alexandrou AN (2000) Fiber spinning in viscous fluid flow. CRC Press LLC, New YorkzbMATHGoogle Scholar

Copyright information

© The Brazilian Society of Mechanical Sciences and Engineering 2019

Authors and Affiliations

  1. 1.Department of Industrial EngineeringUniversity of Engineering and TechnologyPeshawarPakistan
  2. 2.College of Mechanical and Electrical EngineeringNanjing University of Aeronautics and AstronauticsNanjingPeople’s Republic of China
  3. 3.Faculty of Mechanical EngineeringGhulam Ishaq Khan Institute of Engineering Sciences and TechnologyTopiPakistan

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