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Welding in the World

, Volume 62, Issue 5, pp 1119–1119 | Cite as

Publisher Correction to: Development of SnAgCu solders with Bi and In additions and microstructural characterization of joint interface

  • Šimeková Beáta
  • Hodúlová Erika
  • Kovaříková Ingrid
Publisher Correction
  • 167 Downloads

Publisher Correction to: Weld World (2017) 61:613–621

 https://doi.org/10.1007/s40194-017-0446-9

In the original version of this article, the data displayed online in the “About this article” section for “Cite this article as:...,” the first and second name of the second author are incorrect. The correct citation of this article reads “Beáta, Š., Hodúlová E. and Ingrid, K. Weld World (2017) 61: 613.  https://doi.org/10.1007/s40194-017-0446-9”.

Copyright information

© International Institute of Welding 2018

Authors and Affiliations

  • Šimeková Beáta
    • 1
  • Hodúlová Erika
    • 1
  • Kovaříková Ingrid
    • 1
  1. 1.Materials Science and Technology in Trnava, Institute of Production, TechnologiesSlovak University of Technology in BratislavaBratislavaSlovak Republic

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