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ATZelektronik worldwide

, Volume 13, Issue 6, pp 56–59 | Cite as

Chip Embedding of Power Semiconductors in Power Ciruit Boards

  • Adrian Röhrich
  • Christian Rössle
Development
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Modern power electronics for inverter controls, DC-DC converters and battery management are among the key technologies in electrified drives. The demands placed on applications in terms of power density, energy efficiency, reliability and system cost reduction are continuously increasing. The chip embedding of power semiconductors in power circuit boards, as presented by Infineon and Schweizer Electronic AG, meets these requirements. The power semiconductors are no longer soldered onto a printed circuit board as discretely packaged components, but embedded in a so-called system printed circuit board (power and logic) using chip embedding technology.

Requirements

The automotive industry faces the major challenge of continuously reducing average fleet emissions. From 2021, an EU-wide average CO2 emissions limit value of 95 g/km will apply to all newly registered passenger cars. The EU then aims to cut CO2 emissions from new vehicles by a further 30 % or even more between 2021 and 2030.

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Copyright information

© Springer Fachmedien Wiesbaden GmbH, part of Springer Nature 2018

Authors and Affiliations

  • Adrian Röhrich
    • 1
  • Christian Rössle
    • 2
  1. 1.InfineonMünchenGermany
  2. 2.Schweizer Electronic AGSchrambergGermany

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