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Macromolecular Research

, Volume 27, Issue 11, pp 1117–1123 | Cite as

Enhancement of Thermal Conductivity of Poly(methylmethacrylate) Composites at Low Loading of Copper Nanowires

  • Nhat Anh Thi Thieu
  • Minh Canh Vu
  • Eui Sung Lee
  • Vu Chi Doan
  • Sung-Ryong KimEmail author
Article
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Abstract

We report the synthesis of copper nanowires (CuNWs) and the enhanced thermal conductivity of poly(methylmethacrylate) (PMMA) composites at low-loading fractions of CuNW. The scanning electron microscope, X-ray diffractometer, thermal diffusivity meter, high-resistance meter, universal testing machine, and thermogravimetric analyzer were used to investigate the properties of CuNW/PMMA composites. The elongation strain to failure, toughness, and thermal stability of the PMMA composites significantly increased with increasing contents of CuNW. The CuNW/PMMA composites showed the thermal conductivity and volume resistivity of 0.85 W/mK and 7×1010Ω·m, respectively, at 2.0 wt% of CuNW. The significant improvement of thermal conductivity is attributed to the well-dispersed CuNWs in the PMMA matrix and the high aspect ratio of CuNWs. The experimental results of thermal conductivity fitted well with the Agari model.

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Keywords

Cu nanowires thermal conductivity high aspect ratio toughness volume resistivity 
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Copyright information

© The Polymer Society of Korea and Springer 2019

Authors and Affiliations

  • Nhat Anh Thi Thieu
    • 1
  • Minh Canh Vu
    • 1
  • Eui Sung Lee
    • 1
  • Vu Chi Doan
    • 1
  • Sung-Ryong Kim
    • 1
    Email author
  1. 1.Department of Polymer Science and EngineeringKorea National University of TransportationChungjuKorea

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