Macromolecular Research

, Volume 27, Issue 11, pp 1117–1123 | Cite as

Enhancement of Thermal Conductivity of Poly(methylmethacrylate) Composites at Low Loading of Copper Nanowires

  • Nhat Anh Thi Thieu
  • Minh Canh Vu
  • Eui Sung Lee
  • Vu Chi Doan
  • Sung-Ryong KimEmail author


We report the synthesis of copper nanowires (CuNWs) and the enhanced thermal conductivity of poly(methylmethacrylate) (PMMA) composites at low-loading fractions of CuNW. The scanning electron microscope, X-ray diffractometer, thermal diffusivity meter, high-resistance meter, universal testing machine, and thermogravimetric analyzer were used to investigate the properties of CuNW/PMMA composites. The elongation strain to failure, toughness, and thermal stability of the PMMA composites significantly increased with increasing contents of CuNW. The CuNW/PMMA composites showed the thermal conductivity and volume resistivity of 0.85 W/mK and 7×1010Ω·m, respectively, at 2.0 wt% of CuNW. The significant improvement of thermal conductivity is attributed to the well-dispersed CuNWs in the PMMA matrix and the high aspect ratio of CuNWs. The experimental results of thermal conductivity fitted well with the Agari model.


Cu nanowires thermal conductivity high aspect ratio toughness volume resistivity 


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Supplementary material

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Supporting Information


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Copyright information

© The Polymer Society of Korea and Springer 2019

Authors and Affiliations

  • Nhat Anh Thi Thieu
    • 1
  • Minh Canh Vu
    • 1
  • Eui Sung Lee
    • 1
  • Vu Chi Doan
    • 1
  • Sung-Ryong Kim
    • 1
    Email author
  1. 1.Department of Polymer Science and EngineeringKorea National University of TransportationChungjuKorea

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