, Volume 11, Issue 1, pp 14–24 | Cite as

Iodide as Terminating Agent for Platinum Electrodeposition

  • Sebastian ProchEmail author
  • Shuhei Yoshino
  • Juntaro Seki
  • Naoko Takahashi
  • Kousuke Kitazumi
  • Kensaku KodamaEmail author
  • Yu MorimotoEmail author
Original Research


“Approximate” Pt layers hold great promise to be highly active and durable oxygen reduction reaction (ORR) catalysts. Electrodeposition of such layers on relevant catalyst supports, for example TiOx, requires the application of a “Pt-on-Pt” deposition limiter to keep layers thin and leave no atom behind for catalysis. Classic Pt-on-Pt deposition limiting agents like CO and over-potential deposited hydrogen (Hopd) work reliably on gold but fail on TiOx substrates. Iodide, in contrast, is a new “Pt-on-Pt” deposition limiting agent that shows substantial Pt layer thickness reduction during electrodeposition on gold as well as TiOx substrates.

Graphical Abstract

Limitations are not always a bad thing: The addition of NaI during Pt electrodeposition from Ar-saturated 0.1 mM K2PtCl4 + 0.1 M HClO4 solution limits the Pt deposition amount and leads to a substantial reduction in Pt layer thickness and a concurrent increase in ORR mass activity.


Proton-exchange membrane fuel cells (PEMFCs) Oxygen reduction reaction (ORR) Limited electrodeposition Approximate layer Over-potential deposited hydrogen (HopdIodide 



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Copyright information

© Springer Science+Business Media, LLC, part of Springer Nature 2019

Authors and Affiliations

  1. 1.Toyota Central R&D Labs., Inc.NagakuteJapan
  2. 2.Sandvik Materials TechnologySandvikenSweden

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