Skip to main content
SpringerLink
Log in

Corrosion Behavior of Ultra Fine Grain Copper Produced by Accumulative Roll Bonding Process

  • Technical Paper
  • Published:
Transactions of the Indian Institute of Metals Aims and scope Submit manuscript

Abstract

In this study the effect of microstructure changes on the corrosion behavior of pure tough pitch copper in 3.5 % NaCl solution with pH = 5.5 at ambient temperature was studied. Accumulative roll bonding process as severe plastic deformation was applied up to 8 cycles to produce the ultrafine grain copper. For corrosion resistance investigations, the polarization and electrochemical impedance spectroscopy was used. Corrosion morphologies analyzed by FE-SEM microscopy after polarization and immersion tests. Results show the minimum corrosion resistance for cycle 2 and maximum corrosion resistance for cycle 8. Corrosion rate of copper decreased after it was rolled for forth time. The corrosion degradation in cycle 8 was uniform and it was intergranular for sample of cycle 2 and unrolled counterpart. The higher corrosion rate in cycle 2 was attributed to unstable microstructure and the uniform corrosion of cycle 8 was due to ultra fine grain formation.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6

Similar content being viewed by others

References

  1. Gleiter H, Nanostruct Mater 1 (1992) 1.

    Article  CAS  Google Scholar 

  2. Segal V M, Mater Sci Eng A 197 (1995) 157.

    Article  Google Scholar 

  3. Shaarbaf M and Toroghinejad M R, Mater Sci Eng. A 473 (2008) 28.

    Article  Google Scholar 

  4. Cherukuri B, Nedkova T S and Srinivasan R, Mater Sci Eng A 410–411 (2005) 394.

    Google Scholar 

  5. Saito Y, Utsunomiya H, Tsuji N and Sakai T, Acta Mater 47 (1999) 579.

    Article  CAS  Google Scholar 

  6. Huang X, Tsuji N, Minamino Y and Hansen N, The 22nd Risø International Symposium on Materials Science, Roskild (2001).

    Google Scholar 

  7. Tsuji N, Saito Y, Lee S H and Minamino Y, Adv Eng Mater 5 (2003) 338.

    Article  CAS  Google Scholar 

  8. Tsuji N, Saito Y, Utsunomiya H and Tanigawa S, Scripta Mater 40 (1999) 795.

    Article  CAS  Google Scholar 

  9. Gordo P M, Duarte Naia M, Ramos A S, Vieira M T and Kajcsos Z, Positron studies on nanocrystalline copper thin films doped with nitrogen”, in: Proceedings ICPA15—15th International Conference on Positron Annihilation, Kolkata, India (2009).

    Google Scholar 

  10. Vinogradov A, Mimaki T, Hashimoto S and Valiev R Z, Scripta Mater 41 (1999) 319.

    Article  CAS  Google Scholar 

  11. Xu X X, Nie F L, Zhang J X, Zheng W, Zheng Y F, Hu C and Yang G, Mater Lett 64 (2010) 524.

    Article  CAS  Google Scholar 

  12. Yamasaki T, Miyamoto H, Mimaki T, Vinogradov A and Hashimoto S, Mater Sci Eng A 318 (2001) 122.

    Article  Google Scholar 

  13. Miyamoto H, Harada K, Mimaki T, Vinogradov A and Hashimoto A, Corros Sci 50 (2008) 1215.

    Article  CAS  Google Scholar 

  14. Janeceki M, Hadzima B, Hellma R J and Estrin Y, Kovove Mater 43 (2005) 258.

    Google Scholar 

  15. Danaee I, J Electroanal Chem 662 (2011) 415.

    Article  CAS  Google Scholar 

  16. Macdonald J R, Solid State Ion 13 (1984) 147.

    Article  CAS  Google Scholar 

  17. Jang Y H, Kim S S, Han S Z, Lim C Y, Kim C J and Goto M, Scripta Mater 52 (2005) 21.

    Article  CAS  Google Scholar 

  18. Han S Z, Lim C, Kim C J and Kim S, Mater Sci Forum 475–479 (2005) 3497.

    Article  Google Scholar 

  19. Sherif E S M, Appl Surf Sci 252 (2006) 8615.

    Article  CAS  Google Scholar 

  20. Pourbaix M, Establishment and Interpretation of Potential: pH Equilibrium Diagrams, in Atlas of Electrochemical Equilibria in Aqueous Solutions, National Association of Corrosion Engineers. Tex, Houston (1974).

    Google Scholar 

  21. Li W, Hu M, Zhang S and Hou B, Corros Sci 53 (2011) 735.

    Article  CAS  Google Scholar 

  22. Danaee I, Niknejad Khomami M and Attar A A, Mater Chem Phys 135 (2012) 658.

    Article  CAS  Google Scholar 

  23. Niknejad Khomami M, Danaee I, Attar A A and Peykari M, Trans Indian Inst Met 65 (2012) 303.

    Article  Google Scholar 

  24. Danaee I and Noori S, Int J Hydrogen Energy 36 (2011) 12102.

    Article  CAS  Google Scholar 

  25. Khaled K F, Mater Chem Phys 112 (2008) 104.

    Article  CAS  Google Scholar 

Download references

Acknowledgments

Appreciation is to Iranian nano technology initiative council and Tabriz Oil Refining Company for their financially supports of this work. Authors would also like to express their sincere gratitude to Eng. K. Irani for cooperation and coordination throughout this research.

Author information

Authors and Affiliations

  1. Abadan Faculty of Petroleum Engineering, Petroleum University of Technology, 63165, Abadan, Iran

    A. Nikfahm & I. Danaee

  2. Department of Materials Engineering, Faculty of Engineering, Shahid Chamran University, Ahvaz, Iran

    A. Ashrafi

  3. Department of Materials Engineering, Isfahan University of Technology, Isfahan, Iran

    M. R. Toroghinejad

Authors
  1. A. Nikfahm
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. I. Danaee
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. A. Ashrafi
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. M. R. Toroghinejad
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to I. Danaee.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Nikfahm, A., Danaee, I., Ashrafi, A. et al. Corrosion Behavior of Ultra Fine Grain Copper Produced by Accumulative Roll Bonding Process. Trans Indian Inst Met 67, 115–121 (2014). https://doi.org/10.1007/s12666-013-0323-1

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s12666-013-0323-1

Keywords

Search

Navigation