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Synthesis of High Refractive Index Epoxy Modified Methyl Phenyl Silicone Resin and Amine Phenyl Silicone Resin for LEDs Packaging

  • Zhaoqun PanEmail author
  • Shuangli Zhu
  • Liqiang Zhu
  • Yingzi Kang
  • Bingsheng Huang
Original Paper
  • 4 Downloads

Abstract

A series of epoxy modified methyl phenyl silicone resins with different epoxy values were prepared by an approach of combination of hydrolytic sol-gel and non-hydrolytic sol-gel process. Then, in order to solve poor compatibility between epoxy modified silicone resins and commercial amine curing agents, amine phenyl silicone resin curing agent was synthesized by non-hydrolytic sol-gel method. The test results exhibited that the process of combination of hydrolytic sol-gel and non-hydrolytic sol-gel process had a significant effect on the elimination of hydroxyl groups. A lot of experiments and mechanism analysis exhibited that the activity and content of hydroxyl groups are two important factors for ring-opening of epoxy groups and gelation of product. So, epoxy groups can be stably and efficiently introduced in the terminal of product in the course of non-hydrolytic sol-gel process, which hugely avoided ring-opening of epoxy groups. Subsequently, epoxy modified silicone materials were obtained by thermal curing reaction between epoxy modified silicone resins with different epoxy values and amine phenyl silicone resin. And the curing reaction can be completed at 80 °C for 2 h. Transmittance of light, thermogravimetric (TG) analysis, differential scanning calorimetry (DSC) and reliability test were used to analyze performance of epoxy modified silicone materials. The results exhibited that prepared silicone materials had a high transmittance (>90%), strong adhesive strength, good thermal stability and mechanical performance. Therefore, epoxy modified silicone material can be applied in high-power LEDs packaging.

Keywords

Hydrolytic sol-gel Non-hydrolytic sol-gel Epoxy modified methyl phenyl silicone resin Amine phenyl silicone resin curing agent Epoxy modified silicone materials LEDs packaging 

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Notes

Acknowledgements

This project was supported by Department of education’s Production-Study-Research combined innovation Funding -- “Blue fire plan (Huizhou)”.

Compliance with Ethical Standards

Conflict of Interest

The authors declare that they have no conflict of interest.

References

  1. 1.
    Anithambigai P, Chakravarthii MKD, Mutharasu D, Huong LH, Zahner T, Lacey D, Kamarulazizi I (2016). J Mater Sci 28:856–867Google Scholar
  2. 2.
    Gao N, Liu WQ, Ma SQ, Tang CY, Yan ZL (2012). J Polym Res 19:9923CrossRefGoogle Scholar
  3. 3.
    Huang JC, Chu YP, Wei M, Deanin RD (2004) Comparison of epoxy resins for applications in light-emitting diodes. Adv Polym Technol 23:298–306CrossRefGoogle Scholar
  4. 4.
    Liu YB, Jc D (2008). Chin J Liq Crys Disp 23:508Google Scholar
  5. 5.
    Hwang JH, Kim YD, Kim JW (2011). Phys Status Solidi 7:2157–2161CrossRefGoogle Scholar
  6. 6.
    Kim H, Bae JY, Kim YH, Kim YB, Bae BS (2014). J Appl Polym Sci 131:4401–4404Google Scholar
  7. 7.
    Fu JF, Shi LY, Yuan S, Zhong QD, Zhang DS, Chen Y, Wu J (2008). Polym Adv Technol 19:1597–1607Google Scholar
  8. 8.
    Jin FL, Li X, Park SJ (2015). J Ind Eng Chem 29:1–11CrossRefGoogle Scholar
  9. 9.
    Francis B, Thomas S, Sadhana R, Thuaud N, Ramaswamy R, Jose S, Rao VL (2007). J Polym Sci B Polym Phys 45:2481–2496CrossRefGoogle Scholar
  10. 10.
    Ha M, Graham S (2012). Microelectron Reliab 52:836–844CrossRefGoogle Scholar
  11. 11.
    Lee S, Hong JY, Jang J (2013). ACS Nano 7:5784–5790CrossRefGoogle Scholar
  12. 12.
    Jin FL, Li X, Park SJ (2015). J Ind Eng Chem 29:1–11CrossRefGoogle Scholar
  13. 13.
    Paluvai NR, Mohanty S, Nayak SK (2014). J Macromol Sci-Pol R 53:1723–1758Google Scholar
  14. 14.
    Burkhart A, Fischer J, Mondrzyk A, Ritter H (2014). Macromol Chem Phys 215:421–425CrossRefGoogle Scholar
  15. 15.
    Liu YL, Hsiue GH, Lee RH (1997). J Appl Polym Sci 63:895–912CrossRefGoogle Scholar
  16. 16.
    Barton JM, Hamerton I, Howlin BJ, Jones JR, Liu S (1994). Polym Bull 33:347–353CrossRefGoogle Scholar
  17. 17.
    Baikerikara KK, Scrantonb AB (2001). Polymer 42:431–441CrossRefGoogle Scholar
  18. 18.
    Tey J, Soutar A, Mhaisalkar S, Yu H, Hew K (2006). Thin Solid Films 504:384–390CrossRefGoogle Scholar
  19. 19.
    Crivello JV (2015). J Polym Sci Part A: Polym Chem 37:4241–4254CrossRefGoogle Scholar
  20. 20.
    Yagci Y, Jockusch S, Turro NJ (2010). Macromolecules 43:6245–6260CrossRefGoogle Scholar
  21. 21.
    Stapfer CH, D'Andrea RW (1971). Polym Eng Sci 11:233–239CrossRefGoogle Scholar
  22. 22.
    Kuntz E (1981) Catalytic hydmformylation of olefins USA US4248802 aGoogle Scholar
  23. 23.
    Brinker CJ, Scherer GW (1990) Sol-Gel Scienc. Springer, Dordrecht, pp s475–s495Google Scholar
  24. 24.
    Wenzel J (1985). J Non-Cryst Solids 73:693–699CrossRefGoogle Scholar
  25. 25.
    Schubert U, Huesing N, Lorenz A (1995). Chem Mater 7:2010–2027CrossRefGoogle Scholar
  26. 26.
    And JVC, Mao Z (1997). Chem Mater 9:1554–1561CrossRefGoogle Scholar
  27. 27.
    Pan KX, Zeng XR, Li HQ (2016). Adhes Sci and Technol:1–11Google Scholar
  28. 28.
    Cao J, Hu J, Fan H (2014). Thermochim Acta 593:30–36CrossRefGoogle Scholar
  29. 29.
    Buyl FD (2001). Int J Adhes Adhes 21:411–422CrossRefGoogle Scholar

Copyright information

© Springer Nature B.V. 2019

Authors and Affiliations

  • Zhaoqun Pan
    • 1
    Email author
  • Shuangli Zhu
    • 1
  • Liqiang Zhu
    • 1
  • Yingzi Kang
    • 2
  • Bingsheng Huang
    • 1
  1. 1.School of Chemistry and Chemical EngineeringSouth China University of TechnologyGuangzhouPeople’s Republic of China
  2. 2.School of Mechanical & Automotive EngineeringSouth China University of TechnologyGuangzhouChina

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