Microstructure and properties of Ag–Ti3SiC2 contact materials prepared by pressureless sintering

  • Min Zhang
  • Wu-bian TianEmail author
  • Pei-gen Zhang
  • Jian-xiang Ding
  • Ya-mei Zhang
  • Zheng-ming SunEmail author


Ti3SiC2-reinforced Ag-matrix composites are expected to serve as electrical contacts. In this study, the wettability of Ag on a Ti3SiC2 substrate was measured by the sessile drop method. The Ag–Ti3SiC2 composites were prepared from Ag and Ti3SiC2 powder mixtures by pressureless sintering. The effects of compacting pressure (100–800 MPa), sintering temperature (850–950°C), and soaking time (0.5–2 h) on the microstructure and properties of the Ag–Ti3SiC2 composites were investigated. The experimental results indicated that Ti3SiC2 particulates were uniformly distributed in the Ag matrix, without reactions at the interfaces between the two phases. The prepared Ag–10wt%Ti3SiC2 had a relative density of 95% and an electrical resistivity of 2.76 × 10-3 mΩ·cm when compacted at 800 MPa and sintered at 950°C for 1 h. The incorporation of Ti3SiC2 into Ag was found to improve its hardness without substantially compromising its electrical conductivity; this behavior was attributed to the combination of ceramic and metallic properties of the Ti3SiC2 reinforcement, suggesting its potential application in electrical contacts.


MAX phase Ag–Ti3SiC2 contact materials wettability pressureless sintering 


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This research is financially supported by the National Natural Science Foundation of China (Nos. 51731004, 51671054, and 51501038) and “the Fundamental Research Funds for the Central Universities” in China.


  1. [1]
    M. Antler, Electrical effects of fretting connector contact materials: a review, Wear, 106(1985), No. 1–3, p. 5.CrossRefGoogle Scholar
  2. [2]
    M. Grandin and U. Wiklund, Friction, wear and tribofilm formation on electrical contact materials in reciprocating sliding against silver–graphite, Wear, 302(2013), No. 1–2, p. 1481.CrossRefGoogle Scholar
  3. [3]
    P.B. Joshi, R.H. Patel, P.S. Krishnan, V.L. Gadgeel, V.K. Kaushika, and P. Ramakrishnan, Powder metallurgical silver–metal oxide electrical contacts by an electroless coating process, Adv. Powder Technol., 7(1995), 2, p. 121.CrossRefGoogle Scholar
  4. [4]
    S.H. Choi, B. Ali, S.Y. Kim, S.K. Hyun, S.J. Seo, K.T. Park, B.S. Kim, T.S. Kim, and J.S. Park, Fabrication of Ag–SnO2 contact materials from gas-atomized Ag–Sn powder using combined oxidation and ball-milling process, Int. J. Appl. Ceram. Technol., 13(2016), 2, p. 258.CrossRefGoogle Scholar
  5. [5]
    P.B. Joshi, N.S.S. Murti, V.L. Gadgeel, V.K. Kaushik, and P. Ramakrishnan, Preparation and characterization of Ag–ZnO powders for applications in electrical contact materials, J. Mater. Sci. Lett., 14(1995), 16, p. 1099.CrossRefGoogle Scholar
  6. [6]
    J. Swingler and J.W. McBride, The erosion and arc characteristics of Ag/CdO and Ag/SnO2 contact materials under DCbreak conditions, IEEE Trans. Compon. Packag. Manuf. Technol, A, 3(1996), 19, p. 404.CrossRefGoogle Scholar
  7. [7]
    S.C. Dev, O. Basak, and O.N. Mohanty, Development of cadmium-free silver metal–oxide contact materials, J. Mater. Sci., 28(1993), 24, p. 6540.CrossRefGoogle Scholar
  8. [8]
    D. Jeannot, J. Pinard, P. Ramoni, and E.M. Jost, Physical and chemical properties of metal oxide additions to Ag–SnO2 contact materials and predictions of electrical performance, IEEE Trans. Compon. Packag. Manuf. Technol, A, 17(1994), 1, p. 17.CrossRefGoogle Scholar
  9. [9]
    V. Behrens, T. Honig, A. Kraus, R. Michal, K. Saeger, R. Schmidberger, and T. Staneff, An advanced silver/tin oxide contact material, IEEE Trans. Compon. Packag. Manuf. Technol, A, 17(1994), 1, p. 24.CrossRefGoogle Scholar
  10. [10]
    Z.M. Sun, Progress in research and development on MAX phases: a family of layered ternary compounds, Int. Mater. Rev., 56(2013), 3, p. 143.CrossRefGoogle Scholar
  11. [11]
    T.L. Ngai, Y.H. Kuang, and Y.Y. Li, Impurity control in pressureless reactive synthesis of pure Ti3SiC2 bulk from elemental powders, Ceram. Int., 38(2012), 1, p. 463.CrossRefGoogle Scholar
  12. [12]
    Z.M. Li, F. Luo, C.C. He, Z. Yang, P.X. Li, and Y. Hao, Improving the microwave dielectric properties of Ti3SiC2 powders by Al doping, J. Alloys Compd., 618(2015), p. 508.CrossRefGoogle Scholar
  13. [13]
    H.Y. Li, Y. Zhou, A. Cui, Y. Zheng, Z.Y. Huang, H.X. Zhai, and S.B. Li, Ti3SiC2 reinforced ZA27 alloy composites with enhanced mechanical properties, Int. J. Appl. Ceram. Technol., 13(2016), 4, p. 636.CrossRefGoogle Scholar
  14. [14]
    J.R. Lu, Y. Zhou, Y. Zheng, S.B. Li, Z.Y. Huang, and H.X. Zhai, Effects of sintering process on the properties of Ti3SiC2/Cu composite, Key Eng. Mater., 512-515(2012). p. 377.CrossRefGoogle Scholar
  15. [15]
    Y. Zhang, Z.M. Sun, and Y.C. Zhou, Cu–Ti3SiC2 composite: a new electrofriction material, Mater. Res. Innovations, 3(1999), 2, p. 80.CrossRefGoogle Scholar
  16. [16]
    W.T. Dang, S.F. Ren, J.S. Zhou, Y.J. Yu, Z. Li, and L.Q. Wang, Influence of Cu on the mechanical and tribological properties of Ti3SiC2, Ceram. Int., 42(2016), 8, p. 9972.CrossRefGoogle Scholar
  17. [17]
    Z.B. Zhang and S.F. Xu, Copper–Ti3SiC2 composite powder prepared by electroless plating under ultrasonic environment, Rare Met., 26(2007), 4, p. 359.CrossRefGoogle Scholar
  18. [18]
    J. Zhang, G.C. Wang, Y.M. He, Y. Sun, and X.D. He, Effect of joining temperature and holding time on microstructure and shear strength of Ti2AlC/Cu joints brazed using Ag–Cu filler alloy, Mater. Sci. Eng. A., 567(2013), p. 58.CrossRefGoogle Scholar
  19. [19]
    L.M. Peng, Fabrication and properties of Ti3AlC2 particulates reinforced copper composites, Scripta Mater., 56(2007), 9, p. 729.CrossRefGoogle Scholar
  20. [20]
    H. Xie, T.L. Ngai, P. Zhang, and Y.Y. Li, Erosion of Cu–Ti3SiC2 composite under vacuum arc, Vacuum, 114(2015), p. 26.CrossRefGoogle Scholar
  21. [21]
    L.F. Hu, R. Benitez, S. Basu, I. Karaman, and M. Radovic, Processing and characterization of porous Ti2AlC with controlled porosity and pore size, Acta Mater., 60(2012), 18, p. 6266.CrossRefGoogle Scholar
  22. [22]
    W.J. Wang, H.X. Zhai, L.L. Chen, Z.Y. Huang, G.P. Bei, and P. Greil, Preparation and mechanical properties of TiCx–(NiCu)3Al–CuNi2Ti–Ni hybrid composites by reactive pressureless sintering pre-alloyed Cu/Ti3AlC2 and Ni as precursor, Mater. Sci. Eng. A., 670(2016), p. 351.CrossRefGoogle Scholar
  23. [23]
    Z.Q. Sun, M.S. Li, L.F. Hu, X.P. Lu, and Y.C. Zhou, Surface chemistry, dispersion behavior, and slip casting of Ti3AlC2 suspensions, J. Am. Ceram. Soc., 92(2009), 8, p. 1695.CrossRefGoogle Scholar
  24. [24]
    X. Zeng, J. Teng, J.G. Yu, A.S. Tan, D.F. Fu, and H. Zhang, Fabrication of homogeneously dispersed graphene/Al composites by solution mixing and powder metallurgy, Int. J. Miner. Metall. Mater., 25(2018), 1, p. 102.CrossRefGoogle Scholar
  25. [25]
    S.L. Yang, Z.M. Sun, H. Hashimoto, and T. Abe, Ti3SiC2 powder synthesis from Ti/Si/TiC powder mixtures, J. Alloys Compd., 358(2003), No. 1–2, p. 168.CrossRefGoogle Scholar
  26. [26]
    J.R. Lu, Y. Zhou, Y. Zheng, H.Y. Li, and S.B. Li, Interface structure and wetting behaviour of Cu/Ti3SiC2 system, Adv. Appl. Ceram., 114(2015), 1, p. 39.CrossRefGoogle Scholar
  27. [27]
    O. Dezellus, R. Voytovych, A. P.H. Li, G. Constantin, F. Bosselet, and J.C. Viala, Wettability of Ti3SiC2 by Ag–Cu and Ag–Cu–Ti melts, J. Mater. Sci., 45(2009), 8, p. 2080.CrossRefGoogle Scholar
  28. [28]
    Y.C. Zhou and W.L. Gu, Chemical reaction and stability of Ti3SiC2 in Cu during high-temperature processing of Cu/Ti3SiC2 composites, Z. Metallkd., 95(2004), 1, p. 50.CrossRefGoogle Scholar
  29. [29]
    T. El-Raghy, M.W. Barsoum, and M. Sika, Reaction of Al with Ti3SiC2 in the 800–1000°C temperature range, Mater. Sci. Eng, A, 298(2001), No. 1–2, p. 174.CrossRefGoogle Scholar
  30. [30]
    J. Zhang, J.Y. Wang, and Y.C. Zhou, Structure stability of Ti3AlC2 in Cu and microstructure evolution of Cu–Ti3AlC2 composites, Acta Mater., 55(2007), 13, p. 4381.CrossRefGoogle Scholar
  31. [31]
    G.W. Bentzel, M. Ghidiu, J. Griggs, A. Lang, and M.W. Barsoum, On the interactions of Ti2AlC, Ti3AlC2, Ti3SiC2 and Cr2AlC with pure sodium at 550°C and 750°C, Corros. Sci., 111(2016), p. 568.CrossRefGoogle Scholar
  32. [32]
    L.E. Nielsen, The thermal and electrical conductivity of two-phase systems, Ind. Eng. Chem. Fundam., 13(1974), 1, p. 17.CrossRefGoogle Scholar

Copyright information

© University of Science and Technology Beijing and Springer-Verlag GmbH Germany, part of Springer Nature 2018

Authors and Affiliations

  1. 1.Jiangsu Key Laboratory of Advanced Metallic Materials, School of Materials Science and EngineeringSoutheast UniversityNanjingChina
  2. 2.Jiangsu Key Laboratory of Construction Materials, School of Materials Science and EngineeringSoutheast UniversityNanjingChina

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