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Rare Metals

pp 1–10 | Cite as

Microstructure and properties of continuous casting Ag–28Cu–8Sn alloy fabricated by dieless drawing

  • Ji-Heng Fang
  • Ming Xie
  • Ji-Ming Zhang
  • You-Cai Yang
  • Yong-Tai Chen
  • Song Wang
  • Man-Men Liu
  • Jie-Qiong Hu
Article

Abstract

Ag–28Cu–8Sn (wt%) alloy is a widely used brittle silver-based brazing filler metal. The wire of brazing filler metal was prepared by continuous casting process and dieless drawing technology. The phase structure was measured by X-ray diffraction (XRD), and the microstructure of wetting interface, cast states, processing states and fracture morphologies were characterized by the optical microscopy (OM) and scanning electron microscopy (SEM), respectively. The electrical conductivity, hardness, tensile strength and elongation rate were tested as well. Furthermore, the solid–liquid phase temperature was measured by a differential scanning calorimeter (DSC), and the wettability of brazing filler metal was tested by spreading method. The outcomes obtained show that the as-cast microstructure is a typical three-zone structure, including region of surface fine grain, zone of columnar grain and region of center equiaxed crystal. Ag–28Cu–8Sn alloy is mainly composed of Ag-rich α-phase, Cu-rich β-phase and intermediate compounds. Grain refinement appears in the cross section, as for grains of the longitudinal section, the shape is changed from ribbon to fiber to form a silk texture. The strength and hardness improve with the increase in the true strain, while the conductivity and elongation are reduced. Furthermore, the solid-phase temperature is 605.9 °C, and the liquid-phase temperature is 725.1 °C. The spreading area of Ag–28Cu–8Sn brazing filler metal is 174 mm2, and the metallurgical bonding occurs between Ag–28Cu–8Sn brazing filler metal and Cu matrix. In addition, compared with cold drawing process, there are not any microcracks at the fracture morphology for the alloy fabricated by dieless drawing. The dieless drawing process overcomes some processing defects of traditional cold drawing, and the processing performance of Ag–28Cu–8Sn alloy is improved.

Keywords

Continuous casting Cold drawing Dieless drawing Microstructure Properties 

Notes

Acknowledgements

This study was financially supported by the National Natural Science Foundation of China (Nos. U1602271 and U1302272).

References

  1. [1]
    Robert JS, Daniel JL. Directional solidification in a AgCuSn eutectic alloy. Metall Mater Trans A. 2005;36(10):2775.CrossRefGoogle Scholar
  2. [2]
    Daniel L, Sarah A, Michael N, Adam S. Determination of the eutectic structure in the Ag–Cu–Sn system. J Electron Mater. 2002;31(2):161.CrossRefGoogle Scholar
  3. [3]
    Li H, Zhang HF, Wang LB, Zhai GJ, Ding BZ, Mai ZH, Hu ZQ. Interfacial morphologies between iron and Ag–Cu–Sn alloy. Chin Sci Bull. 1999;44(16):1463.CrossRefGoogle Scholar
  4. [4]
    Yang JL, Xue SB, Liu H, Xue P, Dai W, Shi XM, Guo FF. Effects of silicon on microstructures and properties of Al–40Zn–xSi filler metal. Rare Metal Mater Eng. 2016;45(2):333.CrossRefGoogle Scholar
  5. [5]
    Zhang LG, Xu K, Zhao M. Research progress on precious metals medium-low temperature brittle filler metals for electronic industry. Precious Met. 2014;35(03):71.Google Scholar
  6. [6]
    Liu ZG, Chen DQ, Xu K, Luo XM, Chen LW. Structure analysis of gold–tin alloy prepared by D-KH method. Precious Met. 2005;26(3):30.Google Scholar
  7. [7]
    Kopyto M, Onderka B, Zabdyr LA. Thermodynamic properties of the liquid Ag–Cu–Sn lead-free solder alloys. Mater Chem Phys. 2010;122(2–3):480.CrossRefGoogle Scholar
  8. [8]
    Chen DQ, Li W, Luo XM, Xu K. Research progress of Au and Ag based mid-temperature brazing filler alloys for electronic industry. Precious Met. 2009;30(3):62.Google Scholar
  9. [9]
    Gierlotka W. Thermodynamic description of the quaternary Ag–Cu–In–Sn system. J Electron Mater. 2012;41(1):86.CrossRefGoogle Scholar
  10. [10]
    Twohig E, Tiernan P, Tofail SAM. Experimental study on dieless drawing of nickel–titanium alloy. J Mech Behav Biomed Mater. 2012;8(2):8.CrossRefGoogle Scholar
  11. [11]
    Liu XF, Wu YH, Xie JX. Deformation behavior of Cu–12 wt%Al alloy wires with continuous columnar crystals in dieless drawing process. Sci China Ser E. 2009;52(8):2232.CrossRefGoogle Scholar
  12. [12]
    Hwang YM, Kuo TY. Dieless drawing of stainless-steel tubes. Int J Adv Manuf Technol. 2013;68(5–8):1311.CrossRefGoogle Scholar
  13. [13]
    Twohig E, Tiernan P, Tofail SAM. Experimental study on dieless drawing of nickel–titanium alloy. J Mech Behav Biomed Mater. 2012;8(2):2.Google Scholar
  14. [14]
    Furushima T, Hirose Y, Tada K. Development of superplastic dieless drawing apparatus for 3Y-TZP zirconia ceramic tube. Mater Sci Forum. 2016;838(1):597.CrossRefGoogle Scholar
  15. [15]
    Chen K, Wang Z, Zhang Y. FEM simulation to temperature field of stainless steel in dieless forming. Met Form Technol. 2002;4(3):43.Google Scholar
  16. [16]
    Liu X, He Y, Bi C. Simulation on electromagnetic and temperature fields in dieless drawing forming of NiTi shape memory alloy wires. Rare Met. 2005;29(5):763.Google Scholar
  17. [17]
    Sun T, Yue F, Wu HJ, Guo C, Li Y, Ma ZC. Solidification structure of continuous casting large round billets under mold electromagnetic stirring. J Iron Steel Res Int. 2016;23(4):329.CrossRefGoogle Scholar
  18. [18]
    Xie SS, Xie WH, Huang SH. Numerical simulation of temperature field of copper and copper alloy in horizontal continuous casting. Rare Met. 1999;18(3):195.Google Scholar
  19. [19]
    Wang YC, Li DY, Peng Yh, Zhu LG. Computational modeling and control system of continuous casting process. Int J Adv Manuf Technol. 2007;33(1–2):1.CrossRefGoogle Scholar
  20. [20]
    He Y, Liu XF, Xie JX, Zhang HG. Processing limit maps for the stable deformation of dieless drawing. Int J Miner Metall Mater. 2011;18(3):330.CrossRefGoogle Scholar
  21. [21]
    Liu K, Jiang Z, Zhou H. Effect of heat treatment on the microstructure and properties of deformation-processed Cu–7Cr in situ composites. J Mater Eng Perform. 2015;24(11):4340.CrossRefGoogle Scholar
  22. [22]
    Wang LA, Song KA, Wang QB, Gao A, Zhang YA. Influence of drawing deformation on microstructure and properties of pure copper wires with different diameters. J Henan Univ Sci Technol. 2013;34(3):15.Google Scholar
  23. [23]
    Kang BH, Jaluria Y. Thermal modeling of the continuous casting process. J Thermophys Heat Transf. 2015;7(7):139.Google Scholar
  24. [24]
    Ma XQ, Niu HZ, Yu ZT, Yu S, Wang C. Microstructural adjustments and mechanical properties of a cold-rolled biomedical near β-Ti alloy sheet. Rare Met. 2018;37(10):846.CrossRefGoogle Scholar
  25. [25]
    Villar A, Parrondo J, Arribas JJ. Waste heat recovery technology in continuous casting process. Clean Technol Environ. 2014;17(2):555.CrossRefGoogle Scholar
  26. [26]
    Prince A. Phase diagrams of precious metal alloys. Int Mater Rev. 1984;29(1):44.CrossRefGoogle Scholar
  27. [27]
    He ZY, Ding LP. Investigation on Ag–Cu–Sn brazing filler metals. Mater Chem Phys. 1997;49(1):1.CrossRefGoogle Scholar
  28. [28]
    Qiao YD, Wang X, Liu ZY, Wang ED. Microstructures, textures and mechanical properties evolution during cold drawing of pure Mg. Microsc Res. 2013;1(2):8.CrossRefGoogle Scholar
  29. [29]
    Kharitonov VA, Stolyarov AY. Development of a competitive technology to make wire for metal cord. Metallurgist. 2013;57(3–4):320.CrossRefGoogle Scholar
  30. [30]
    Lin ZC, Shen B, Sun FH, Zhang ZM, Guo SS. Numerical and experimental investigation of trapezoidal wire cold drawing through a series of shaped dies. Int J Adv Manuf Technol. 2015;76(5–8):1383.CrossRefGoogle Scholar
  31. [31]
    Pei YZ, Zhou XY, Zhu TJ. Editorial for rare metals, special issue on advanced thermoelectric materials. Rare Met. 2018;37(4):257.CrossRefGoogle Scholar
  32. [32]
    Heidarzadeh A, Saeid T. Correlation between process parameters, grain size and hardness of friction-stir-welded Cu–Zn alloys. Rare Met. 2018;37(5):388.CrossRefGoogle Scholar
  33. [33]
    Wu F, Zhou WL, Zhao B, Hou HJ. Interface microstructure and bond strength of 1420/7B04 composite sheets prepared by diffusion bonding. Rare Met. 2018;37(7):613.CrossRefGoogle Scholar
  34. [34]
    Kim SD, Kim SY, Joo JH, Woo SK. Microstructure and electrical conductivity of Mo/TiN composite powder for alkali metal thermal to electric converter electrodes. Ceram Int. 2014;40(3):3847.CrossRefGoogle Scholar
  35. [35]
    Krishna C, Jha AK, Pant B, George KM. Achieving higher strength in Cu–Ag–Zr alloy by warm/hot rolling. Rare Met. 2017;36(4):263.CrossRefGoogle Scholar
  36. [36]
    Qu WT, Sun SG, Hui SX, Wang ZG, Li Y. High-temperature deformation behavior of a beta Ti–3.0Al–3.5Cr–2.0Fe–0.1B alloy. Rare Met. 2018;37(3):217.CrossRefGoogle Scholar
  37. [37]
    Shang JL, Yan JZ, Li N. Brazing W and Fe–Ni–Co alloy using Ag–28Cu and Ag–27Cu–3.5Ti fillers. J Alloys Compd. 2014;611(28):91.CrossRefGoogle Scholar
  38. [38]
    Shiue RK, Tsay LW, Lin CL, Ou JL. A study of Sn–Bi–Ag–(In) lead-free solders. J Mater Sci. 2003;38(6):1269.CrossRefGoogle Scholar
  39. [39]
    Choi S, Bieler TR, Lucas JP, Subramanian KN. Characterization of the growth of intermetallic interfacial layers of Sn–Ag and Sn–Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging. J Electron Mater. 1999;28(11):1209.CrossRefGoogle Scholar
  40. [40]
    Zhong ZW. Assembly and reliability of flip chip on boards using ACAs or eutectic solder with underfill. Microelectron Int. 1999;16(3):6.CrossRefGoogle Scholar
  41. [41]
    Liu HB, Qin YQ, Sun L, Mu BB, Zhang DF, Shi JX. Research on brazing technologies of coper with Ag–Cu eutectic solder in vacuum. J Shanghai Univ Eng Sci. 2013;27(2):148.Google Scholar
  42. [42]
    Eustathopoulos N, Nicholas MG, Drevet B. Wettability at high temperature. Elsevier. San Diego: Ipswich; 1999. 416.Google Scholar
  43. [43]
    Kong YG, Kong ZG, Shi FM. Microstructure and mechanical property of Sn–Ag–Cu solder material. Rare Met. 2017;36(3):193.CrossRefGoogle Scholar
  44. [44]
    Zeng K, Tu KN. Six cases of reliability study of Pb-free solder joints in electronic packaging technology. J Mater Sci Eng. 2002;38(2):55.CrossRefGoogle Scholar
  45. [45]
    Sathorn C, Palamara JE, Palamara D. Effect of root canal size and external root surface morphology on fracture susceptibility and pattern: a finite element analysis. J Endodont. 2005;31(4):288.CrossRefGoogle Scholar

Copyright information

© The Nonferrous Metals Society of China and Springer-Verlag GmbH Germany, part of Springer Nature 2018

Authors and Affiliations

  1. 1.State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum MetalKunmingChina

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