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3-dimensional circuit device fabrication process using stereolithography and direct writing

  • Sung Hyun Jang
  • Sung Taek Oh
  • In Hwan LeeEmail author
  • Ho-Chan Kim
  • Hae Yong Cho
Article

Abstract

Additive manufacturing (AM) technology is a method to fabricate a 3-dimensional structure by stacking thin layers. Among AM technologies, it is known that stereolithography (SL) technology can fabricate a structure having high dimensional accuracy. Recently, this technology is being applied for real manufacturing. Meanwhile, direct writing (DW) technology has been used to apply a lowviscosity liquid material on a substrate. In this regards, in this research, we applied the DW technology to deposit a conductive material on the surface of a three-dimensional structure. Moreover, a three-dimensional circuit device (3DCD) which is different from conventional two-dimensional PCBs can be fabricated by the hybrid process of SL and DW technologies. An insulated structure of circuit board having high precision was fabricated using stereolithography. Furthermore, a circuit is fabricated on the several layers using DW. And the 3DCD sample that detects a light was fabricated, successfully.

Keywords

Additive manufacturing Stereolithography Direct writing Photopolymer Conductive material 

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Copyright information

© Korean Society for Precision Engineering and Springer-Verlag Berlin Heidelberg 2015

Authors and Affiliations

  • Sung Hyun Jang
    • 1
  • Sung Taek Oh
    • 2
  • In Hwan Lee
    • 3
    Email author
  • Ho-Chan Kim
    • 4
  • Hae Yong Cho
    • 3
  1. 1.Gumi Electronics and Information Technology Research Institute (GERI)Gyeongsangbuk-doSouth Korea
  2. 2.Department of Precision Mechanical EngineeringChungbuk National UniversityChungcheongbuk-doSouth Korea
  3. 3.School of Mechanical EngineeringChungbuk National UniversityChungcheongbuk-doSouth Korea
  4. 4.Department of Mechanical and Automotive EngineeringAndong National UniversityGyeongsangbuk-doSouth Korea

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