Recent Advances in Active Metal Brazing of Ceramics and Process

  • S. Mishra
  • A. Sharma
  • D. H. Jung
  • J. P. JungEmail author


Ceramic to metal joining has its potential applications in microelectronics packaging, metal–ceramic seals, vacuum tubes, sapphire metal windows, etc. But there are many limitations in joining this duo of materials that range from their structures, nature of bonding, physical properties to a complex phenomenon like wetting, spreading and adhesion. The current review discusses these critical issues from the aspects of thermodynamics, the role, and type of active elements, Ag–Cu–Ti brazing filler system and the reliability factors like residual stress, coefficient of thermal expansion, material reliability, pores and unbonded regions on the surface which affect the mechanical reliability of the joint.

Graphic Abstract


Ceramic Metal Active metal brazing Wetting Reliability 



This work was supported by the Technology development program (S2517123) funded by the Ministry of SME’s and Startups (MSS, Korea) and also supported by the Korea Institute of Energy Technology Evaluation and Planning (KETEP) and the Ministry of Trade, Industry & Energy (MOTIE) of the Republic of Korea (No. 20172020109280).


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Copyright information

© The Korean Institute of Metals and Materials 2019

Authors and Affiliations

  • S. Mishra
    • 1
  • A. Sharma
    • 2
  • D. H. Jung
    • 1
  • J. P. Jung
    • 1
    Email author
  1. 1.Department of Materials Science and EngineeringUniversity of SeoulSeoulRepublic of Korea
  2. 2.Department of Materials Science and Engineering and Department of Energy Systems ResearchAjou UniversitySuwonRepublic of Korea

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