Low-Temperature Sintering Characteristics of Ag-Based Complex Inks Using Transient Melting and Joining of Sn–58Bi Nanoparticles
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A novel complex ink was fabricated by mixing Sn–58Bi nanoparticles with a commercial conductive ink containing Ag nanoparticles and then sintered rapidly for 110 s at 140 °C in air using a conveyor-type reflow furnace. Sn–58Bi nanoparticles smaller than 15 nm wetted on the neighboring Ag nanoparticles immediately after melting at temperatures lower than their melting point, and hence, acted as transient liquid-phase binders. The composite film sintered with 4 wt% Sn–58Bi exhibited stability and a low electrical resistivity of 4.46 μΩ cm, and hence, was found to be compatible with low-cost flexible films.
KeywordsSintering Electrical resistivity Thin films Nanostructure Complex ink
- 21.J. Zhao, Y. Gao, W. Zhang, T. Song, Q. Zhai, J. Mater. Sci.: Mater. Electron. 23, 2221 (2012)Google Scholar