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Numerical investigation on thermophoretic deposition of particles in turbulent duct flow with conjugate heat transfer: Analysis of influencing factors

  • Hao Lu
  • Li-zhi ZhangEmail author
  • Rong-rong Cai
Research Article
  • 9 Downloads

Abstract

Thermophoretic deposition of particles in turbulent duct flow is of significant relevance in energy and thermal engineering applications. However, conjugate heat transfer (CHT) was commonly not considered in the previous studies, but may have crucial influences on particle deposition behaviors. Therefore, thermophoretic particle deposition in turbulent duct flow with and without CHT was numerically investigated by using \(\overline {v{\prime ^{_2}}} - f\) turbulence model and discrete particle model (DPM) with a modified discrete random walk method. After grid independence study and numerical verification, several important influencing factors on particle deposition velocity were studied, such as flow Reynolds number, temperature difference between inlet hot air and cool wall, thermal conductivity ratio and width ratio of solid and fluid domain. The thermophoresis greatly increases deposition velocity of small particles but has no influence on large particles. The critical particle relaxation time \(\tau _{\rm{p}}^ + \) for thermophoresis effect is 20, which is the same for all the cases in this study. The corresponding particle diameter is 28 µm. The thermophoretic deposition is enhanced when the flow Reynolds number and temperature difference between air and wall increase. This is because the wall-normal temperature variety is higher for large Reynolds number and temperature difference, which can enhance thermophoretic deposition. However, CHT reduces the thermophoretic deposition by decreasing temperature difference in fluid region. Besides, higher thermal conductivity ratio and width ratio of solid and fluid domain will decrease the thermophoretic deposition, as thermal conduction in solid domain becomes more intense.

Keywords

particle deposition conjugate heat transfer influencing factors 

List of symbols

A

area of particle deposition

B

thickness of solid wall

Cc

Cunningham correction factor

C0

mean particle concentration

CD

drag coefficient of particle

Cps

specific pressure heat of solid wall

dp

diameter of dust particle

f

an elliptic equation for the relaxation function

fc

fanning friction factor

g

gravitational acceleration

H

width of half duct

J

particle deposition number

k

turbulent kinetic energy

Kc

Saffman’s lift force coefficient

Nd

number of dust deposited on the walls

N0

total particle number

Re

Reynolds number

Rep

particle Reynolds number

sij

deformation tensor

S

ratio of particle-to-fluid density

S0

spectral intensity of a Gaussian white noise random process

SE

volumetric heat source in solid domain

td

time period of dust deposition

Ts

temperature of solid domain

Tf

ttemperature of fluid domain

Umean

mean velocity of air

Ufree

freestream velocity of air

ug

velocity of fluid

up

velocity of particle

u*

frictional velocity of air

v

wall-normal fluctuating velocity of air

\(\overline {v{\prime ^{_2}}}\)

wall-normal stress of flow

V

volume of duct flow

Vd

particle deposition velocity

\(V_{\rm{d}}^ + \)

dimensionless particle deposition velocity

ρg

density of fluid

ρp

density of particle

ρs

density of solid wall

ζ

normal distributed random number

ν

kinetic viscosity of air

τ

particle relaxation time

Δt

time step

λs

thermal conductivity of solid domain

λf

thermal conductivity of fluid domain

\(\tau _{\rm{p}}^ + \)

dimensionless particle relaxation time

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Notes

Acknowledgements

The authors appreciate the financial supports provided by the National Key Research and Development Program (No. 2017YFE0116100), the “Xinghua Scholar Talents Plan” of South China University of Technology (D6191420) and the Fundamental Research Funds for the Central Universities (D2191930). It is also supported by the National Science Fund for Distinguished Young Scholars (No. 51425601) and the Science and Technology Planning Project of Guangdong Province: Guangdong-Hong Kong Technology Cooperation Funding Scheme (TCFS), No. 2017B050506005.

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Copyright information

© Tsinghua University Press and Springer-Verlag GmbH Germany, part of Springer Nature 2019

Authors and Affiliations

  1. 1.Key Laboratory of Enhanced Heat Transfer and Energy Conservation of Education Ministry, School of Chemistry and Chemical EngineeringSouth China University of TechnologyGuangzhouChina

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