Journal of Micro-Nano Mechatronics

, Volume 6, Issue 1–2, pp 23–31 | Cite as

Self-assembly of dies through electrostatic attraction: modelling of alignment forces and kinematics

  • Johan Dalin
  • Jürgen Wilde
  • Panos Lazarou
  • Nikolaos Aspragathos
Research Paper

Abstract

A variety of self-assembly procedures have been introduced. An interesting and prospective application of this technology is the manufacturing of heterogeneously integrated electronic circuits. The two main approaches are top-down and bottom-up self-assembly. Top-down self-assembly is a massively parallel approach for assembly and alignment of small but highly functional parts onto a substrate without using additional machinery. This paper discusses a concept where electrostatic forces are used to achieve top-down self-alignment of parts in the micro- and milli scale. This approach is also concievable to accomplish accurate alignment of pre-positioned dies, for example electronic integrated circuits. For this approach complementary and electrically conductive micro-structured patterns serve as alignment structures. Experimental results have verified that it is feasible to accomplish self-assembly and accurate alignment of single micro-structured parts. The alignment forces and kinematics for parts in the range of a few hundred micrometers have been modelled and computed, respectively. Simulations have been performed in Matlab/Simulink. The presented simulation tool along with the experimental results is the first steps towards the modelling and the realisation of a massively parallel assembly approach of dies.

Keywords

Electrostatic self-assembly Hybrid integrated circuits Accurate die alignment 

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Copyright information

© Springer-Verlag 2010

Authors and Affiliations

  • Johan Dalin
    • 1
  • Jürgen Wilde
    • 1
  • Panos Lazarou
    • 2
  • Nikolaos Aspragathos
    • 2
  1. 1.IMTEK - Department of Microsystems EngineeringUniversity of FreiburgFreiburgGermany
  2. 2.Robotics Group, Department of Mechanical Engineering & AeronauticsUniversity of PatrasPatrasGreece

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