Journal of Micro-Nano Mechatronics

, Volume 6, Issue 1–2, pp 23–31 | Cite as

Self-assembly of dies through electrostatic attraction: modelling of alignment forces and kinematics

  • Johan Dalin
  • Jürgen Wilde
  • Panos Lazarou
  • Nikolaos Aspragathos
Research Paper


A variety of self-assembly procedures have been introduced. An interesting and prospective application of this technology is the manufacturing of heterogeneously integrated electronic circuits. The two main approaches are top-down and bottom-up self-assembly. Top-down self-assembly is a massively parallel approach for assembly and alignment of small but highly functional parts onto a substrate without using additional machinery. This paper discusses a concept where electrostatic forces are used to achieve top-down self-alignment of parts in the micro- and milli scale. This approach is also concievable to accomplish accurate alignment of pre-positioned dies, for example electronic integrated circuits. For this approach complementary and electrically conductive micro-structured patterns serve as alignment structures. Experimental results have verified that it is feasible to accomplish self-assembly and accurate alignment of single micro-structured parts. The alignment forces and kinematics for parts in the range of a few hundred micrometers have been modelled and computed, respectively. Simulations have been performed in Matlab/Simulink. The presented simulation tool along with the experimental results is the first steps towards the modelling and the realisation of a massively parallel assembly approach of dies.


Electrostatic self-assembly Hybrid integrated circuits Accurate die alignment 



This work was carried out within the frame of the EC 4M Network of Excellence “Multi-Material Micro Manufacture: Technologies and Applications” program, the internal project “Microassembly Automation” of the University of Patras and the MNI-mst program from the German Federal Ministry of Education and Research - “Nanopad”.

Mr. Gaurav Jain, Mr. Bocheng Jin, Mr. Azeem Zulfiqar and Mr. Aris Synodinos have also made important contributions.


  1. 1.
    Parviz BA, Ryan D, Whitesides GM (2003) Using self-assembly for the fabrication of nano-scale electronic and photonic devices. IEEE Trans Adv Packaging 26(3):233–241CrossRefGoogle Scholar
  2. 2.
    Li QL et al (2002) Capacitance and conductance characterization of ferrocene-containing self-assembled monolayers on silicon surfaces for memory applications. Appl Phys Lett 81:1494–1496CrossRefGoogle Scholar
  3. 3.
    Ashurst WR, Yau C, Carraro, Maboudian R, Dugger MT (2001) Dichlorodimethylsilane as an anti-stiction monolayer for MEMS: a comparison to the octadecyltrichlosilane self-assembled monolayer. J Microelectromech Syst 10:41–49CrossRefGoogle Scholar
  4. 4.
    Notzel R (1996) Self-organized growth of quantum-dot structures. Semicond Sci Technol 11:1365–1379CrossRefGoogle Scholar
  5. 5.
    Xia YN, Gates B, Li ZY (2001) Self-assembly approaches to threedimensional photonic crystals. Adv Mater 13:409–413CrossRefGoogle Scholar
  6. 6.
    Whitesides GM, Ostuni E, Takayama S, Jiang XY, Ingber DE (2001) Soft lithography in biology and biochemistry. Annu Rev Biomed Eng 3:335–373CrossRefGoogle Scholar
  7. 7.
    Dalin J, Wilde J (2009) Self-assembly of micro-structured parts using electrostatic forces and surface tension. Electronic Components and Technology Conference, pp 1517–1524Google Scholar
  8. 8.
    Camon H et al (2008) Solving functional reliability issue for an optical electrostatic switch. Technical Paper in Microsystem Technology 14(7):919–923CrossRefGoogle Scholar
  9. 9.
    Enikov ET, Minkov LL, Clark S (2005) Micro-assembly experiments with transparent electrostatic gripper under optical and vision-based control. IEEE Trans Ind Electron 52(4):1005–1012CrossRefGoogle Scholar
  10. 10.
    Bohringer K et al (1998) Parallel microassembly with electrostatic force fields. Proc IEEE Int Conf Robotics and Automation (ICRA) 2:1204–1211Google Scholar
  11. 11.
    Nordquist CD et al. (2000) An electro-fluidic assembly technique for integration of III-V devices onto silicon. IEEE International Symposium on Compound Semiconductors, pp 137–142Google Scholar
  12. 12.
    Winkleman A, Gates BD, McCarty LS, Whitesides GM (2005) Directed self-assembly of spherical particles on patterned electrodes by an applied electric field. Technical Paper in Advanced Materials 17(12):1507–1511Google Scholar
  13. 13.
    Edman CF et al. (2006) Methods for the electronic, homogeneous assembly and fabrication of devices. United States Patent 7060224Google Scholar
  14. 14.
    Bruce TJ (1984) Energy Methods. Advanced dynamics for engineers HRW series in mechanical engineering. CBS College Publishing, United States of AmericaGoogle Scholar
  15. 15.
    Greenwood DT (19977) Classical Dynamics, Dover Publications IncGoogle Scholar
  16. 16.
    De Rooij NF et al. (1992) Micromechanical comb actuators with low driving voltage, Proc of the 3rd Intl. Conf. On New Actuators, pp 250–255Google Scholar
  17. 17.
    Dalin J, Wilde J, Zulfiqar A, Lazarou P, Synodinos A, Aspragathos N (2010) Electrostatic attraction and surface-tension-driven forces for accurate self-assembly of parts. Journal of Microelectronics Engineering (Elsevier BV) 87(2):159–162Google Scholar
  18. 18.
    Ratkowsky DA (1990) Handbook of nonlinear regression models. Marcel Dekker IncGoogle Scholar
  19. 19.
    Lawson CL, Hanson RJ (1974) Solving least squares problems. Prentice-HallGoogle Scholar
  20. 20.
    Cho Y-H et al (1994) Slide film damping in laterally driven microstructures. Sensors and Actuators A: Physical. pp 31–39Google Scholar
  21. 21.
    Veijola T (2000) Compact damping models for lateral structures including gas rarefaction effects. Proc MSM, pp 162–165Google Scholar

Copyright information

© Springer-Verlag 2010

Authors and Affiliations

  • Johan Dalin
    • 1
  • Jürgen Wilde
    • 1
  • Panos Lazarou
    • 2
  • Nikolaos Aspragathos
    • 2
  1. 1.IMTEK - Department of Microsystems EngineeringUniversity of FreiburgFreiburgGermany
  2. 2.Robotics Group, Department of Mechanical Engineering & AeronauticsUniversity of PatrasPatrasGreece

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