Journal of Mechanical Science and Technology

, Volume 32, Issue 7, pp 3309–3316 | Cite as

Manuscript numerical simulation on ultra-precision polishing of monocrystalline silicon by SPH method

  • Xiu Lei
  • Lv Gang
  • Xu Yan
  • Qiao Yang
  • Jiang Hai
  • Wang Xianwei
  • Ye Xia


Ultra-precision polishing is an important processing method for monocrystalline silicon, in order to improve the machining efficiency and obtain good machining quality, it is necessary to investigate the material removal process and process parameters of ultra-precision polishing. Smoothed particle hydrodynamics (SPH) is a meshless method with good self-adaptability, it can be used in the simulation of ultra-precision polishing which has high speed deformation characteristics. The calculation model and SPH analysis model of ultraprecision polishing are established according to the principle of ultra-precision polishing, SPH method is used to simulate and analyze ultra-precision polishing of the monocrystalline silicon. The material removal process of ultra-precision polishing is investigated, the effects of abrasive size and indentation depth on the equivalent plastic strain (PEEQ), Mises stress and the force of abrasive is investigated. The result is that, at the different time of ultra-precision polishing, the maximum PEEQ is different, but the difference is not obvious; the X direction force of the abrasive increases with the indentation depth; the size of abrasive has a great influence on the soft coefficient of stress state in ultra-precision polishing. According to the simulation results, it is possible to optimize the technological parameters of ultra-precision polishing, and provide the theoretical guidance for practical production.


SPH Ultra-precision polishing Monocrystalline silicon Numerical simulation 


Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.


  1. [1]
    X. L. Zhu, R. K. Kang, G. Feng and H. M. Lv, Research on topography control of two-spindle and three-workstationwafer grinder, Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science, 225 (9) (2011) 2232–2241.Google Scholar
  2. [2]
    H. Xinglei et al., Performance evolution process of machined surface of monocrystalline silicon micro/nanostructures, Acta Phys. Sin., 62 (22) (2013) 220704.Google Scholar
  3. [3]
    Z. Xianglong et al., Ultra-precision grinding technology and grinder of silicon wafers, China Mechanical Engineering, 21 (18) (2010) 2156–2164.Google Scholar
  4. [4]
    L. Fang, Q. Cen and K. Sun, FEM computation of groove ridge and Monte Carlo simulation in two-body abrasive wear, Wear, 258 (1–4) (2005) 265–274.CrossRefGoogle Scholar
  5. [5]
    Y.-Y. Lin and S.-P. Lo, Finite element modeling for chemical mechanical polishing process under different back pressures, Journal of Materials Processing Technology, 140 (1–3) (2003) 646–652.CrossRefGoogle Scholar
  6. [6]
    B. Zhu et al., Effects of vibration frequency on vibration-assisted nano-scratch process of monocrystalline copper via molecular dynamics simulation, AIP Advances, 6 (2016) 035015.CrossRefGoogle Scholar
  7. [7]
    Y. Yang et al., Molecular dynamics simulation of selfrotation effects on ultra-precision polishing of single-crystal copper, AIP Advances, 3 (2013) 102106.CrossRefGoogle Scholar
  8. [8]
    X. Du et al., Molecular dynamics investigations of mechanical behaviours in monocrystalline silicon due to nanoindentation at cryogenic temperatures and room temperature, Scientific Reports, 5 (2015) 16275.CrossRefGoogle Scholar
  9. [9]
    L. B. Lucy, A numerical approach to the testing of the fission hypothesis, The Astronomical Journal, 82 (1977) 1013–1024.CrossRefGoogle Scholar
  10. [10]
    J. J. Monaghan, An introduction to SPH, Computer Physics Communications, 48 (1) (1988) 89–96.CrossRefzbMATHGoogle Scholar
  11. [11]
    J. J. Monaghan, Why particle methods work, SIAM Journal on Scientific and Statistical Computing, 3 (4) (1982) 422–433.MathSciNetCrossRefzbMATHGoogle Scholar
  12. [12]
    R. A. Gingold and J. J. Monaghan, Smoothed particle hydrodynamics: Theory and application to non-spherical stars, Monthly Notices of the Royal Astronomical Society, 181 (1977) 375–389.CrossRefzbMATHGoogle Scholar
  13. [13]
    W. K. Liu, S. Jun and Y. F. Zhang, Reproducing kernel particle methods, International Journal for Numerical Methods in Fluids, 20 (8–9) (1995) 1081–1106.MathSciNetCrossRefzbMATHGoogle Scholar
  14. [14]
    H. Naceur et al., Efficient smoothed particle hydrodynamics method for the analysis of planar structures undergoing geometric nonlinearities, Journal of Mechanical Science and Technology, 29 (5) (2015) 2147–2155.MathSciNetCrossRefGoogle Scholar
  15. [15]
    B. J. Son et al., Optimal design of a composite space shield based on numerical simulations, Journal of Mechanical Science and Technology, 29 (12) (2015) 5299–5308.CrossRefGoogle Scholar
  16. [16]
    L. Xiaojie et al., Numerical study on the effect of equations of state of water on underwater explosions, Engineering Mechanics, 31 (8) (2014) 46–52.Google Scholar
  17. [17]
    Z. Wu, Z. Zong and L. Sun, A Mie-Grüneisen mixture Eulerian model for underwater explosion, Engineering Computations, 31 (3) (2014) 425–452.CrossRefGoogle Scholar
  18. [18]
    H. Yongyao et al., Numerical simulation of long-tube penetration to semi-infinite target, Journal of Ballistics, 16 (2) (2004) 33–36.Google Scholar
  19. [19]
    C. Jun et al., Experimental investigation on material removal process for micro-grinding of single crystal silicon, Journal of Mechanical Engineering, 50 (17) (2014) 194–200.CrossRefGoogle Scholar
  20. [20]
    D. Lee and H. Lee, Estimating the mechanical properties of polyurethane-impregnated felt pads, Journal of Mechanical Science and Technology, 31 (12) (2017) 5705–5710.CrossRefGoogle Scholar
  21. [21]
    L. Zhang et al., A study on phase transformation of monocrystalline silicon due to ultra-precision polishing by molecular dynamics simulation, AIP Advances, 2 (2012) 042116.CrossRefGoogle Scholar
  22. [22]
    X. Han, Y. Hu and S. Yu, Investigation of material removal mechanism of silicon wafer in the chemical mechanical polishing process using molecular dynamics simulation method, Applied Physics A, 95 (2009) 899–905.CrossRefGoogle Scholar
  23. [23]
    D. Lee, H. Lee and H. Jeong, The effects of a spray slurry nozzle on copper CMP for reduction in slurry consumption, Journal of Mechanical Science and Technology, 29 (12) (2015) 5057–5062.CrossRefGoogle Scholar
  24. [24]
    L. Qinghua, J. Fangran and L. Fuguo, Relationship of stress state and stress state parameters in plastic deformation, Forging and Stamping Technology, 39 (3) (2014) 122–126.Google Scholar
  25. [25]
    Z. Hao et al., Investigation of fracture mechanism of 6063 aluminum alloy under different stress states, International Journal of Fracture, 146 (3) (2007) 159–172.MathSciNetCrossRefGoogle Scholar

Copyright information

© The Korean Society of Mechanical Engineers and Springer-Verlag GmbH Germany, part of Springer Nature 2018

Authors and Affiliations

  • Xiu Lei
    • 1
  • Lv Gang
    • 1
  • Xu Yan
    • 1
  • Qiao Yang
    • 1
  • Jiang Hai
    • 1
  • Wang Xianwei
    • 2
  • Ye Xia
    • 2
  1. 1.Department of Mechanical EngineeringHefei UniversityHefeiChina
  2. 2.School of Mechanical EngineeringJiangsu University of TechnologyChangzhouChina

Personalised recommendations