Journal of Mechanical Science and Technology

, Volume 29, Issue 4, pp 1377–1382 | Cite as

Study on thin copper-wire distribution for heat transfer enhancement from wall to interior of an isothermal chamber

  • Yang Lihong
  • Shen Hangming


This paper studied the distribution of thin copper wire in an isothermal chamber cross section through topological methods to enhance heat transfer from the wall to the interior and to improve the isothermal characteristics of the isothermal chamber. First, the heat transfer model was built and discretized by finite volume method. Then, the model was verified through the result of temperature field calculation, which was consistent with the ANSYS analysis under the condition that the copper wire was stuffed uniformly. Under the circumstance where the temperature of the container wall, the average stuffed density of thin copper wire, and the initial temperature in the center were all the same as in the uniformly filled case, and taking the maximum of the center temperature as the optimization objective after heat transfer for 15 s, the linear variable density filling method and the adaptive growth method were used to optimize the copper wire distribution. Compared with the uniformly filled case, the results of the center temperature increased by 4.94% and 16.50%. Therefore, heat conduction from the wall to interior of the chamber can be enhanced by using topological methods to change the distribution of thin copper wires. Linear variable density filling method and adaptive growth method can be used to optimize the structure of thermal conductivity. Moreover, the result of adaptive growth method is better than the linear variable density filling method. During the isothermal chamber discharge, the chamber wall is the most important heat resource. Thus, this method can be used to improve the characteristics of isothermal chambers.


Isothermal chamber Porous media Heat transfer enhancement Topology optimization 


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Copyright information

© The Korean Society of Mechanical Engineers and Springer-Verlag Berlin Heidelberg 2015

Authors and Affiliations

  1. 1.School of Mechanical EngineeringUniversity of Shanghai for Science and TechnologyShanghaiChina

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