JOM

, Volume 51, Issue 2, pp 49–52 | Cite as

Applying TLP bonding to the joining of structural intermetallic compounds

  • William F. Gale
Overview Reactive Liquid Processing

Abstract

Transient-liquid-phase bonding provides a method of joining nonweldable materials intended for elevated temperature service. This paper discusses the mechanisms of transient-liquid-phase bonding as a reactive liquid process for the joining of structural intermetallic compounds. The importance of alloying reactions for successful wetting of the substrates by the liquid interlayer is stressed, and the roles of dissolution, isothermal solidification, and homogenization processes in microstructural development are discussed.

Keywords

Filler Metal Bonding Temperature Fusion Welding Friction Welding Isothermal Solidification 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© TMS 1999

Authors and Affiliations

  • William F. Gale
    • 1
  1. 1.Materials Research and Education CenterAuburn UniversityAuburn

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