Applying TLP bonding to the joining of structural intermetallic compounds
Overview Reactive Liquid Processing
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Abstract
Transient-liquid-phase bonding provides a method of joining nonweldable materials intended for elevated temperature service. This paper discusses the mechanisms of transient-liquid-phase bonding as a reactive liquid process for the joining of structural intermetallic compounds. The importance of alloying reactions for successful wetting of the substrates by the liquid interlayer is stressed, and the roles of dissolution, isothermal solidification, and homogenization processes in microstructural development are discussed.
Keywords
Filler Metal Bonding Temperature Fusion Welding Friction Welding Isothermal Solidification
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