Electromigration Behavior of Screen-Printing Silver Nanoparticles Interconnects
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Printing technology is one of the promising patterning techniques in flexible electronic devices due to its low cost and large-area patternability. In this study, the electromigration (EM) behavior of printed interconnects composed of silver nanoparticles was investigated under a current density of 1.5 × 105 A/cm2 at ambient temperature of 150°C. During the EM test, the morphologies of silver nanoparticles changed as a result of the decrease in the cross-section of the interconnect and the increase in Joule heating generated under high current density. Once the temperature at the cathode of printed interconnects was higher than 350°C, the aggregation and grain growth of Ag nanoparticles began to occur. The Ag particles formed an island-like morphology and the connection among the Ag nanoparticles was completely broken, leading to the loss of their electrical conductivity and open-circuit failures of the printed interconnects at the cathode side.
We thank National Tsing Hua University/Industrial Technology Research Institute Joint Research Center, Taiwan, for financial support under Contract No. 104A0305k3 and Ministry of Science and Technology of Taiwan, for financial support under contract No. 105-2221-E-007-024-MY3.
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