, Volume 67, Issue 3, pp 622–628 | Cite as

Laser Hot Wire Process: A Novel Process for Near-Net Shape Fabrication for High-Throughput Applications

  • Michael Kottman
  • Shenjia ZhangEmail author
  • James McGuffin-Cawley
  • Paul Denney
  • Badri K. Narayanan


The laser hot wire process has gained considerable interest for additive manufacturing applications, leveraging its high deposition rate, low dilution, thermal stability, and general metallurgical control including the ability to introduce and preserve desired meta-stable phases. Recent advancements in closed-loop process control and laser technology have increased productivity, process stability, and control of deposit metallurgy. The laser hot wire process has shown success in several applications: repairing and rejuvenating casting dies, depositing a variety of alloys including abrasion wear-resistant overlays with solid and tubular wires, and producing low-dilution (<5%) nickel alloy overlays for corrosion applications. The feasibility of fabricating titanium buildups is being assessed for aerospace applications.


Additive Manufacturing Selective Laser Melting Cold Wire LAAM Additive Manufacturing Process 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.



The application of a laser hot wire to additive manufacturing has been enabled by a research project funded by America Makes (formally the National Additive Manufacturing Innovation Institute) under Project 4007: “Qualifying AM Processes and Procedures for Repurposing and Rejuvenation of Die-Cast Tooling” (D. Schwam, PI) and Project 4032: “High Throughput Functional Material Deposition Using Laser Hot Wire” (J. McGuffin-Cawley). Ti-6Al-4V buildup chemical analysis and substrate material was provided by RTI International Metals Inc., who is also team member of America Makes Project 4032.


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Copyright information

© The Minerals, Metals & Materials Society 2015

Authors and Affiliations

  • Michael Kottman
    • 1
  • Shenjia Zhang
    • 1
    Email author
  • James McGuffin-Cawley
    • 2
  • Paul Denney
    • 1
  • Badri K. Narayanan
    • 1
  1. 1.The Lincoln Electric CompanyClevelandUSA
  2. 2.Case Western Reserve UniversityClevelandUSA

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