JOM

, Volume 65, Issue 9, pp 1245–1253 | Cite as

Probing Deformation and Revealing Microstructural Mechanisms with Cross-Correlation-Based, High-Resolution Electron Backscatter Diffraction

  • T. Ben Britton
  • Jun Jiang
  • Phani S. Karamched
  • Angus J. Wilkinson
Article

Abstract

High-resolution, cross-correlation-based, electron backscatter diffraction (HR-EBSD) is an emerging technique capable of measuring elastic strains, lattice rotations, and defect populations in crystalline materials. Here we briefly review development of the technique and the fundamental method. Application of HR-EBSD to metallic samples is illustrated with three examples: nickel-superalloy matrix/carbide interactions during cyclic deformation; interaction of a slip band and grain boundary; and patterning of stress and dislocation storage in deformed copper. These three examples highlight the ability of HR-EBSD to deliver new science by revealing new insights into the fundamental nature of deformation, as well as validating existing models. Application of the technique is now commonplace, and emergence of the technique is opening it up to the wider materials science community to tackle grand challenges.

Notes

Acknowledgements

We would like to thank Dr. Graham Meaden and Dr. David Dingley for entertaining and insightful discussions of the HR-EBSD approach and Dr. Aimo Winkelmann for the ecpdist program used to generate dynamic EBSD patterns that have greatly assisted us in development and testing of analysis algorithms. We are grateful to the Engineering and Physical Sciences Research Council for funding through grants EP/H018921/1, EP/E044778/1, and EP/K034332/1.

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Copyright information

© TMS 2013

Authors and Affiliations

  • T. Ben Britton
    • 1
    • 2
  • Jun Jiang
    • 1
  • Phani S. Karamched
    • 1
    • 3
  • Angus J. Wilkinson
    • 1
  1. 1.Department of MaterialsUniversity of OxfordOxfordUK
  2. 2.Department of MaterialsImperial College LondonLondonUK
  3. 3.Defence Metallurgical Research LaboratoryHyderabadIndia

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