JOM

, Volume 61, Issue 6, pp 52–58 | Cite as

Surface oxidation of molten Sn(Ag, Ni, In, Cu) alloys

  • Y. Y. Lee
  • H. W. Tseng
  • Y. H. Hsiao
  • C. Y. Liu
Lead-Free Solder Research Summary
First Online:

Abstract

The surface oxidations of molten Sn(Ag, Ni, In, Cu) alloys are studied. We conclude that the microstructure (phase and density) of the surface oxide layer is the key factor for the surface oxidation formation. Also, we found that the microstructure (phase and density) of the Sn surface oxide layer is highly influenced by the additives in the solder alloys, which can be roughly anticipated from the additives’ electromagnetic field values and Gibbs free energies of oxide formation. The detailed effect (either retarding or enhancing) of the additives on the surface oxidation is discussed in this paper.

Keywords

Surface Oxide Solder Alloy PbSn Solder Surface Oxide Layer Oxidation Curve 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.
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References

  1. 1.
    M. Arra et al., “Development of Lead-free Wave Soldering Process,” IEEE Transactions on Electronics Packaging Manufacturing, 25(4) (2002), pp. 289–299.CrossRefGoogle Scholar
  2. 2.
    Neil Briks, Gerald H. Meier, and Fred S. Pettit, Introduction to the High-Temperature Oxidation of Metals, 2nd edition (Cambridge, MA: Cambridge University Press, 2006), pp. 39–74.Google Scholar
  3. 3.
    D.W. Yuan, R.F. Yan, and G. Simkovich, “Rapid Oxidation of Liquid Tin and Its Alloys at 600 to 800°C,” J. Materials Science, 34 (1999), pp. 2911–2920.CrossRefGoogle Scholar
  4. 4.
    Robert C. Weast, CRC Handbook of Chemistry and Physics, 70th edition (Boca Raton, FL: CRC Press, 1989).Google Scholar
  5. 5.
    G.R. Wallwork, “The Oxidation of Alloy,” Rep. Prog. Phys., 39(5) (1976), pp. 401–485.CrossRefADSGoogle Scholar
  6. 6.
    Y. Zhu, K. Mimura, and M. Isshiki, “The Effect of Impurities on the Formation of the Inner Porous Layer in the Cu2O Scale during Copper Oxidation,” Oxidation of Metals, 61(4) (2004), pp. 293–314.CrossRefGoogle Scholar
  7. 7.
    M.J. Alam and D.C. Cameron, “Optical and Electrical Properties of Transparent Conductive ITO Thin Films Deposited by Sol-Gel Process,” Thin Solid Films, 377–378 (2000), pp. 455–459.CrossRefGoogle Scholar
  8. 8.
    Y. Niu, Y. Wu, and F. Gesmundo, “The Oxidation of Three Ni-6Si-xAl alloys in 1 atm O2 at 1000°C,” Corrosion Science, 48 (2006), pp. 1–22.CrossRefGoogle Scholar
  9. 9.
    G. Schimmel et al., “Study on the Microstructure of Internally Oxidized Ag-Sn-In Alloys,” Oxidation of Metals, 70 (2008), pp. 25–38.CrossRefGoogle Scholar

Copyright information

© TMS 2009

Authors and Affiliations

  • Y. Y. Lee
    • 1
  • H. W. Tseng
    • 2
  • Y. H. Hsiao
    • 2
  • C. Y. Liu
    • 2
  1. 1.Institute of Materials Science and EngineeringNew YorkUSA
  2. 2.Department of Chemical and Materials EngineeringNational Central UniversityTaipeiTaiwan

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