JOM

, Volume 53, Issue 6, pp 22–26

Creep properties of Sn-Ag solder joints containing intermetallic particles

  • S. Choi
  • J. G. Lee
  • F. Guo
  • T. R. Bieler
  • K. N. Subramanian
  • J. P. Lucas
Research Summary Lead-Free Solder

Abstract

The creep behavior of the eutectic tin-silver joints and tin-silver composite solder joints containing 20 vol.% of Cu6Sn5, Ni3Sn4, and FeSn2 intermetallic reinforcements introduced by in-situ methods was investigated. These creep tests were carried out using single shear lap solder joints at room temperature, 85°C, and 125°C. The creep resistance was similar in magnitude for all alloys, and with increasing temperature, the stressexponents decreased in a manner consistent with power-law breakdown behavior. The FeSn2 intermetallic reinforced composite solder was found to be the most creep-resistant alloy at room temperature. Creep failure was observed to occur within the solder matrix in all these solder joints. Although a detailed analysis of the processes involved was difficult because of smearing of the features in the fracture surface, there were indications of grain-boundary separation, ductile fracture, and interfacial separation.

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. 1.
    B.P. Richards et al., Lead-Free Soldering (London: U.K. Department of Trade and Industry, 1999).Google Scholar
  2. 2.
    P.T. Vianco and D.R. Frear, JOM, 45 (7) (1993), p. 14.Google Scholar
  3. 3.
    H. Mavoori et al., J. Electron. Mater., 26 (7) (1997), p. 783.Google Scholar
  4. 4.
    S. Chadaet al., Soldering & Surface Mount Technology (26) (July 9, 1997).Google Scholar
  5. 5.
    M. McCormack and S. Jin, 1994 IEEE/CPMT Int. Electronics Manufacturing Technology Symposium (Piscataway, NJ: IEEE, 1994), p. 7.CrossRefGoogle Scholar
  6. 6.
    W. Yang, L.E. Felton, and R.W. Messler, Jr., J. Electron. Mater., 24 (10) (1995), p. 1465.Google Scholar
  7. 7.
    A.W. Gibson et al., Design & Reliability of Solders and Solder Interconnections, ed. R.K. Mahidhara et al. (Warrendale, PA: TMS, 1997), p. 97.Google Scholar
  8. 8.
    S.L. Choi et al., Design & Reliability of Solders and Solder Interconnections, ed. R.K. Mahidhara et al. (Warrendale, PA: TMS, 1997), p. 241.Google Scholar
  9. 9.
    A.W. Gibson et al., IEEE 5th International Symposium on Electronics and the Environment (Piscataway, NJ: IEEE, 1997), p. 246.Google Scholar
  10. 10.
    S. Choi et al., J. Electron. Mater., 2 (10) (2000), p. 1249.CrossRefGoogle Scholar
  11. 11.
    M.D. Mathew, S. Movva, and K.L. Murty, Key Engineering Materials, 171–174 (2000), p. 655.CrossRefGoogle Scholar
  12. 12.
    H. Yang et al., 1996 46th Electronic Components and Technology Conference (Piscataway, NJ: IEEE, 1996), p. 1136.CrossRefGoogle Scholar
  13. 13.
    J. Liang et al., Mater. Res. Soc. Symp. Proc., Vol. 445 (Warrendale, PA: MRS, 1997), p. 307.Google Scholar
  14. 14.
    R. Darveaux and K. Banerji, 1992 42nd Electronic Components and Technology Conference (Piscataway, NJ: IEEE, 1992), p. 538.CrossRefGoogle Scholar
  15. 15.
    V.I. Igoshev et al., J. Electron. Mater., 27 (12) (1998), p. 1367.CrossRefGoogle Scholar
  16. 16.
    D.R. Frear, JOM, 48 (5) (1996), p. 49.Google Scholar
  17. 17.
    S. Choi et al., J. Electron. Mater., 28 (11) (1999), p. 1209.CrossRefGoogle Scholar
  18. 18.
    J.P. Lucas et al., J. Electron. Mater., 28 (11) (1999), p. 1268.CrossRefGoogle Scholar
  19. 19.
    J. McDougall et al., Mater. Sci. Eng., A285 (2000), p. 25.Google Scholar
  20. 20.
    H.D. Blair et al., 1996 IEEE/CPMT Int. Electron. Manuf. Technol. Symp. (Piscataway, NJ: IEEE, 1996), p. 282.CrossRefGoogle Scholar
  21. 21.
    V.I. Igoshev and J.I. Kleiman, J. Electron. Mater., 29 (2) (2000), p. 244.CrossRefGoogle Scholar

Copyright information

© TMS 2001

Authors and Affiliations

  • S. Choi
    • 1
  • J. G. Lee
    • 1
  • F. Guo
    • 1
  • T. R. Bieler
    • 1
  • K. N. Subramanian
    • 1
  • J. P. Lucas
    • 1
  1. 1.the Department of Materials Science & MechanicsMichigan State UniversityUSA

Personalised recommendations