Journal of Phase Equilibria and Diffusion

, Volume 28, Issue 5, pp 433–438 | Cite as

Pb-Free Solders: Part III. Wettability Testing of Sn-Ag-Cu-Bi Alloys with Sb Additions

  • Z. Moser
  • W. Gasior
  • K. Bukat
  • J. Pstruś
  • R. Kisiel
  • J. Sitek
  • K. Ishida
  • I. Ohnuma
Basic and Applied Research

Abstract

Maximum bubble pressure, dilatometric, and meniscographic methods were used in the investigations of the surface tensions, densities, wetting times, wetting forces, contact angles, and solder-flux interfacial tensions of liquid Sn-Ag-Cu-Bi alloys with various additions of Sb. Density and surface tension measurements were conducted in the temperature range 230 to 900 °C. Surface tensions at 250 °C were measured in air and under a protective atmosphere of Ar-H2 and were combined with data from meniscographic studies done under air or with a protective flux. Meniscographic data with a nonwetted Teflon substrate provided data on solder-flux interfacial tensions, and meniscographic data with a Cu substrate allowed determinations of wetting times, wetting forces, and calculations of contact angles. Additions of Sb to quaternary Sn-Ag-Cu-Bi alloys improve wettability, move the parameters closer to those of traditional solders, and affirm, as found in previous studies of Bi additions to the Sn-Ag-Cu near-eutectic compositions, that interfacial tensions and contact angles are the two parameters most important as a metric of wettability. However, in contrast to results found in studies of quaternary Sn-Ag-Cu-Bi alloys, the changes in quinary Sn-Ag-Cu-Bi-Sb alloys of interfacial tensions and contact angles do not correlate with decreasing wetting time and increasing wetting force.

Keywords

density meniscographic studies Pb-free solders surface tension 

References

  1. 1.
    Z. Moser, W. Gasior, K. Bukat, J. Pstruś, R. Kisiel, J. Sitek, K. Ishida, I. Ohnuma, Pb-free Solders. Wettability Testing of Sn-Ag-Cu Alloys With Bi Additions. Part I, J. Phase Equilibria Diff., 2006, 27: 133-139Google Scholar
  2. 2.
    I. Ohnuma, K. Ishida, Z. Moser, W. Gasior, K. Bukat, J. Pstruś, R. Kisiel, J. Sitek, Pb-free solders. Application of ADAMIS data base in modeling of Sn-Ag-Cu alloys with Bi additions. Part II, J. Phase Equilibria Diff., 2006, 27: 245-254CrossRefGoogle Scholar
  3. 3.
    J.A.V. Butler, The Thermodynamics of the Surfaces of Solutions, Proc. R. Soc. (London) A, 1932, CXXXV: 348-375CrossRefADSGoogle Scholar
  4. 4.
    I. Ohnuma, X.J. Liu, H. Ohtani, K. Ishida, Thermodynamic Database for Phase Diagrams in Micro-Soldering Alloys, J. Electron. Mater., 1998, 28: 1164-1171CrossRefGoogle Scholar
  5. 5.
    Z. Moser, W. Gąsior, K. Ishida, I. Ohnuma, X.J. Liu, K. Bukat, J. Pstruś, J. Sitek, and R. Kisiel, Experimental Wettability Studies Combined with the Related Properties from Data Base for Tin Based Alloys With Silver, Copper, Bismuth and Antimony Additions, 134th Annual Meeting & Exhibition, Book of Final Program, Feb 2005 (San Francisco, CA), Feb 2005, TMS, 2005, p 13-17Google Scholar
  6. 6.
    Z. Moser, W. Gąsior, J. Pstruś, S. Księżarek, Surface Tension and Density of the (Ag-Sn)eut+Cu Liquid Alloys, J. Electron. Mater., 2002, 31: 1225-1229CrossRefGoogle Scholar
  7. 7.
    W. Gąsior, Z. Moser, J. Pstruś, K. Bukat, R. Kisiel, J. Sitek, Investigations of the (Ag-Sn)eut + Cu Liquid and Solid Solder Materials. Part 1, J. Phase Equilibria, 2004, 25: 115-121Google Scholar
  8. 8.
    Z. Moser, W. Gąsior, J. Pstruś, K. Ishida, I. Ohnuma, R. Kainuma, S. Ishihara, X.J. Liu, Surface Tension and Density of Sn-Ag-Sb Liquid Alloys and Phase Diagram Calculations of the Sn-Ag-Sb Ternary System, Mater. Trans., 2004, 45: 652-660CrossRefGoogle Scholar
  9. 9.
    M. Miyazaki, M. Mitutani, T. Takemoto, A. Matsunawa, Conditions for Measurement of Surface Tension of Solders with a Wetting Balance Tester, Trans. JWRI, 1997, 26: 81-84Google Scholar
  10. 10.
    Z. Moser, W. Gąsior, J. Pstruś, I. Ohnuma, and K. Ishida, Influence of Sb Additions on Surface Tension and Density of Sn-Sb, Sn-Ag-Sb and Sn-Ag-Cu-Sb alloys: Experiment vs. Modeling. Part 1., Int. J. Mater. Res., Z. Metallkd., 2006, 97, p 365-370. Dedicated to Professor Dr.Ferdinand Sommer on the occasion of his 65th birthdayGoogle Scholar
  11. 11.
    E.P. Lopez, P.T. Vianco, J.A. Rejent, Solderability testing of Sn-Ag-Xcu Pb-Free Solders on Copper and Au-Ni Plated Kovar Substrates, J. Electron. Mater., 2005, 34: 299-310CrossRefGoogle Scholar

Copyright information

© ASM International 2007

Authors and Affiliations

  • Z. Moser
    • 1
  • W. Gasior
    • 1
  • K. Bukat
    • 2
  • J. Pstruś
    • 1
  • R. Kisiel
    • 3
  • J. Sitek
    • 2
  • K. Ishida
    • 4
  • I. Ohnuma
    • 4
  1. 1.Institute of Metallurgy and Materials SciencePolish Academy of SciencesKrakówPoland
  2. 2.Tele and Radio Research InstituteWarszawaPoland
  3. 3.Institute of Microelectronics and OptoelectronicsWarsaw University of TechnologyWarszawaPoland
  4. 4.Department of Materials Science, Graduate School of EngineeringTohoku, UniversitySendaiJapan

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