Role of Si in the Surface Damage Mechanism of RB-SiC/Si Under Mechanical Loading
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Indentation test (Nanoindentation and Vickers indentation), diamond scratching and high spindle speed grinding are conducted to investigate the role of silicon (Si) in the surface damage behavior of reaction-bonded SiC/Si composites (RB-SiC/Si). Even though the addition of Si contributes to densifying the bulk materials and improving the toughness, the indentation and diamond scratching results firstly indicate that the cracks initiate at the SiC/Si interfaces due to the non-uniform deformation caused by the existence of Si, and the phase transformation of Si also leads to the pop-out effect during the nanoindentation and the diamond scratching test. The ground surface of RB-SiC/Si is characterized by scratching grooves and brittle fracture, indicating the ductile material removal mode and brittle material removal mode for RB-SiC/Si, respectively, and the surface reliefs form on the ground surface due to the different hardness between Si and SiC phases. Moreover, the phase transformation of Si contributes to the easy fracture of phase boundaries under the mechanical loading, and the accompanied volume change also results in the dislodgement of hard particles and the generation of surface burs on the ground surface.
Keywordsfracture grain boundaries grinding phase transformation RB-SiC/Si
Brittleness of the material
Depth of cut
The indentation load
The crack length by indentation
The diagonal length of the imprint
L + a
The work was partially supported by the National Natural Science Foundation of China (NSFC) (Project No.: 51805257, 51475109 and 51275231).
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