Electrochemical Behavior of Sn-9Zn-xTi Lead-Free Solders in Neutral 0.5M NaCl Solution
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Electrochemical techniques were employed to study the electrochemical corrosion behavior of Sn-9Zn-xTi (x = 0, 0.05, 0.1, 0.2 wt.%) lead-free solders in neutral 0.5M NaCl solution, aiming to figure out the effect of Ti content on the corrosion properties of Sn-9Zn, providing information for the composition design of Sn-Zn-based lead-free solders from the perspective of corrosion. EIS results reveal that Ti addition was involved in the corrosion product layer and changed electrochemical interface behavior from charge transfer control process to diffusion control process. The trace amount of Ti addition (0.05 wt.%) can refine the microstructure and improve the corrosion resistance of Sn-9Zn solder, evidenced by much lower corrosion current density (icorr) and much higher total resistance (Rt). Excess Ti addition (over 0.1 wt.%) led to the formation of Ti-containing IMCs, which were confirmed as Sn3Ti2 and Sn5Ti6, deteriorating the corrosion resistance of Sn-9Zn-xTi solders. The main corrosion products were confirmed as Sn3O(OH)2Cl2 mixed with small amount of chlorine/oxide Sn compounds.
Keywordscorrosion EIS IMCs lead-free solder Sn-9Zn-xTi
The present research was partially supported by Japan Science and Technology Agency (JST) Advanced Low Carbon Technology Research and Development Program (ALCA) project (Grant No. J165101047). ZhengHong Wang would like to express gratitude to the support from the Chinese Scholars Council (File No. 201606210397).
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