Journal of Materials Engineering and Performance

, Volume 22, Issue 11, pp 3376–3380 | Cite as

Soldering a 3D Wire Lattice Structure

  • R. W. Fonda
  • M. J. Scherr
  • A. B. Geltmacher
  • K. W. Sharp
Article
First Online:
Received:
Revised:

Abstract

Soldering the junctions in a novel woven structure constructed from metallic wires is expected to significantly enhance the mechanical properties of that structure. The ideal bond geometry has solder localized at wire junctions and a uniform amount of solder at each junction throughout the structure. By examining the effects of solvent variations, liquid flux concentration, and solder powder concentration on the soldered joint geometry and distribution, we have developed a new procedure to bond these wire junctions using a very fine solder powder suspended in a flux solution.

Keywords

joining periodic structures textile fabrication weave 
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Notes

Acknowledgments

The authors would like to acknowledge funding from the Defense Advanced Research Projects Agency Materials with Controlled Microstructural Architectures program. We would also like to recognize David Rowenhorst and David Dunand for their helpful discussions and the remainder of the DARPA MCMA team for their support.

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Copyright information

© ASM International 2013

Authors and Affiliations

  • R. W. Fonda
    • 1
  • M. J. Scherr
    • 1
  • A. B. Geltmacher
    • 1
  • K. W. Sharp
    • 2
  1. 1.Naval Research LaboratoryWashingtonUSA
  2. 2.3TEX, Inc.RutherfordtonUSA

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