An improved numerical method for predicting intermetallic layer thickness developed during the formation of solder joints on Cu substrates

Abstract

An improved numerical method has been developed for calculating the thickness of intermetallic layers formed between Cu substrates and solders during the soldering process. The improved method takes into account intermetallic dissolution during heating and intermetallic precipitation during cooling and requires as input (1) the temperature-time profile for the soldering process, (2) the experimentally determined isothermal growth parameters for the growth of the intermetallic layer into Cu saturated molten solder, (3) the experimentally determined Nernst-Brunner parameters for the dissolution of Cu into molten solder, (4) the experimentally determined solubility of Cu in molten solder and (5) assumptions about the thickness of the boundary layer in the liquid ahead of the growing intermetallic. Calculations show that the improved method predicts intermetallic growth between Cu substrates and 96.5Sn-3.5Ag solder during reflow soldering better than a previously developed method, which did not take into account dissolution during heating and precipitation during cooling. Calculations further show that dissolution has a significant effect on growth, while precipitation does not.