Zinc diffusion in InAsP/InGaAs heterostructures
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Abstract
A systematic study of the sealed ampoule diffusion of zinc into epitaxially grown InP, In0.53Ga0.47As, In0.70Ga0.30As, In0.82Ga0.18As, and through the InAsP/InGaAs interface is presented. Diffusion depths were measured using cleave-and-stain techniques, electrochemical profiling, and secondary ion mass spectroscopy. The diffusion coefficients, \(D = D_o e^{ - E_a /kT} \), were derived. For InP, D0=4.82 × 10−2cm2/sec and Ea=1.63 eV and for In0.53Ga0.47As, D0=2.02 × 104cm2/sec and Ea=2.63 eV. Diffusion into the heteroepitaxial structures used in the fabrication of planar PIN photodiodes is dominated by the effects of the InP/InGaAs interface.
Key words
Indium gallium arsenide (InGaAs) indium phosphide (InP) zinc diffusion PIN photodiodePreview
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References
- 1.H. Haupt, Proc. Ninth Int. Conf. Indium Phosphide and Related Materials (Piscataway, NJ: IEEE, 1997), p. 3.CrossRefGoogle Scholar
- 2.G.H. Olsen and V.S. Ban, Solid State Technol. 30, 99 (1987).Google Scholar
- 3.G.H. Olsen, Laser Focus World 27, 21 (1991).Google Scholar
- 4.M.J. Cohen and G.H. Olsen, Laser Focus World 29, 109 (1993).Google Scholar
- 5.K. Nakajima, A. Yamaguchi, K. Akita, and T. Kotani, J. Appl. Phys. 49, 5944 (1978).CrossRefGoogle Scholar
- 6.G.H. Olsen, A.M. Joshi, S.M. Mason, K.M. Woodruff, E. Mykietyn, V.S. Ban, M.J. Lange, J. Hladky, and G.C. Erickson, SPIE Proc.: Infrared Technology XV 1157, 276 (1989).Google Scholar
- 7.S.R. Forrest, V.S. Ban, G.A. Gasparian, D. Gay, and G.H. Olsen, IEEE Electron. Device Lett. 9, 217 (1988).CrossRefGoogle Scholar
- 8.S.R. Forrest, R.F. Leheny, R.E. Nahory, and M.A. Polack, Appl. Phys. Lett. 37, 322 (1980).CrossRefGoogle Scholar
- 9.K.W. Carey, S.Y. Wang, R. Hull, and J.E. Turner, J. Cryst. Growth 77, 558 (1986).CrossRefGoogle Scholar
- 10.M. Wada and H. Hosomatsu, Appl. Phys. Lett. 64, 1265 (1994).CrossRefGoogle Scholar
- 11.K.R. Linga, G.H. Olsen, V.S. Ban, A.M. Joshi, and W.F. Kosonocky, J. Lightwave Technol. 10, 1050 (1992).CrossRefGoogle Scholar
- 12.G.H. Olsen and M. Ettenberg, J. Appl. Phys. 45, 5112 (1974).CrossRefGoogle Scholar
- 13.Y. Takeda, A. Sasaki, Y. Imamura, and T. Takagi, J. Electrochem. Soc. 125, 130 (1978).CrossRefGoogle Scholar
- 14.J.W. Mayer and S.S. Lau, Electron. Mater. Sci.: For Integrated Circuits in Si and GaAs (New York: Macmillan, 1990), pp. 185–195.Google Scholar
- 15.Y. Yamamoto and H. Kanbe, Jpn. J. Appl. Phys. 19, 121 (1980).CrossRefGoogle Scholar
- 16.H.S. Marek and H.B. Serreze, Appl. Phys. Lett. 51, 2031 (1987).CrossRefGoogle Scholar
- 17.M. Geva and T.E. Seidel, J. Appl. Phys. 59 (1986).Google Scholar
- 18.F. Dildey, M. Amann, and R. Treichler, Jpn. J. Appl. Phys. 29, 810 (1990).CrossRefGoogle Scholar
- 19.P. Ambree, A. Hangleiter, M.H. Pilkuhn, and K. Wandel, Appl. Phys. Lett. 56, 931 (1990).CrossRefGoogle Scholar
- 20.D.-S. Kim, S.R. Forest, M.J. Lange, M.J. Cohen, G.H. Olsen, R.J. Mena, and R.J. Paff, J. Appl. Phys. 80, 6229 (1996).CrossRefGoogle Scholar
- 21.A. Fischer-Colbrie, R.D. Jacowitz, and D.G. Ast, J. Cryst. Growth 127, 560 (1993).CrossRefGoogle Scholar
- 22.T. Takarnoto, M. Yumaguchi, E. Ikeda, T. Agui, H. Kurita, and M. Al-Jassim, J. Appl. Phys. 85, 1481 (1999).CrossRefGoogle Scholar
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