X-ray diffraction and high resolution transmission electron microscopy of 3C-SiC/AlN/6H-SiC(0001)
- 176 Downloads
- 7 Citations
Abstract
The structure and crystal quality of epitaxial films of SiC/AlN/6H-SiC(0001) prepared by chemical vapor deposition were evaluated by high resolution transmission electron microscopy (HRTEM) and x-ray diffraction techniques. Cross-sectional HRTEM revealed an abrupt AlN layer-6H-SiC substrate junction, but the transition between the AlN and SiC layers was much rougher, leading to the formation of a highly disordered SiC region adjacent to the interface. The AlN layer was relatively defect free, while the SiC layer contained many microtwins and stacking faults originating at the top SiC/AlN interface. The SiC layer was the 3C-polytype, as determined by double crystal x-ray rocking curves. The SiC layers were under in-plane compressive stress, with calculated defect density between 2–4×107 defects/cm−2.
Key words
Chemical vapor deposition (CVD) high resolution transmission electron microscopy (HRTEM) SiC/AlNPreview
Unable to display preview. Download preview PDF.
References
- 1.T. Stacy, B.Y. Liaw, A.H. Khan and G. Zhao, Wide Band Gap Electronic Materials, ed. M.A. Prelas, P. Gielisse, G. Popovici, B.V. Spitsyn and T. Stacy (Dordrecht, The Netherlands: Kluwer Academic, 1995), p. 475.Google Scholar
- 2.R.F. Davis, G. Kelner, M. Shur, J.W. Palmour and J.A. Edmond, Proc. IEEE, 79, 677 (1991).CrossRefADSGoogle Scholar
- 3.E. Janzen, O. Kordina, A. Henry, W.M. Chen, N.T. Son, B. Monemar, E. Sorman, P. Bergman, C.I. Harris, R. Yakimova, M. Tuominen, A.O. Konstantinov, C. Hallin and C. Hemmingsson, Physica Scripta T54, 283 (1994).CrossRefADSGoogle Scholar
- 4.P. Neudeck, J. Electron. Mater. 24, 283 (1995).Google Scholar
- 5.D. Chandrasekhar, D.J. Smith, S. Strite, M.E. Lin and H. Morkoç, J. Cryst. Growth 152, 135 (1995).CrossRefGoogle Scholar
- 6.F.A. Ponce, B.S. Krusor, J.S. Major, Jr., W.E. Plano and D.F. Welch, Appl. Phys. Lett. 67, 410 (1995).CrossRefADSGoogle Scholar
- 7.T.W. Weeks, Jr., M.D. Bremser, K.S. Ailey, E. Carlson, W.G. Perry, E.L. Piner, N.A. El-Masry and R.F. Davis, J. Mater. Res. 11, 1011 (1996).ADSGoogle Scholar
- 8.J. Chaudhuri, R. Thokala, J.H. Edgar and B.S. Sywe, J. Appl. Phys. 77, 6263 (1995).CrossRefADSGoogle Scholar
- 9.B.S. Sywe, Z.J. Yu, S. Burckhard, J.H. Edgar and J. Chaudhuri, J. Electrochem. Soc. 141, 510 (1994).CrossRefGoogle Scholar
- 10.S. Nishino, K. Takahashi, H. Tanaka and J. Saraie, Silicon Carbide and Related Materials, 137, (London: Inst. of Physics, 1994), p. 63.Google Scholar
- 11.L.B. Rowland, R.S. Kern, S. Tanaka and R.F. Davis, J. Mater. Res. 8, 2310 (1993).ADSGoogle Scholar
- 12.L.B. Rowland, R.S. Kern, S. Tanaka and R.F. Davis, Appl. Phys. Lett. 62, 3333 (1993).CrossRefADSGoogle Scholar
- 13.D.P. Beesabathina, K. Fekade, K. Wongchotigul, M.G. Spencer and L. Salamanca-Riba, Diamond, SiC and Nitride Wide Bandgap Semiconductors, ed. C.H. Carter, Jr., G. Gildenblat, S. Nakamura and R.J. Nemanich, (Pittsburgh, PA: Materials Research Society, 1994), p. 363.Google Scholar
- 14.H. Matsunami, Phys. B 185, 65 (1993).CrossRefADSGoogle Scholar
- 15.S. Tanaka, R.S. Kern and R.F. Davis, Appl. Phys. Lett. 65, 2851 (1994).CrossRefADSGoogle Scholar
- 16.J. Chaudhuri, R. Thokala, J.H. Edgar and B.S. Sywe, Thin Solid Film (1996).Google Scholar
- 17.S. Tanaka, R.S. Kern, J. Bentley and R.F. Davis, Jpn. J. Appl. Phys. 35, 1641 (1996).CrossRefGoogle Scholar