Various kinds of contaminants depositing on printed circuit board (PCB) assembly in electronic products, such as the airborne dust and the process residues, can aggravate the condensation on the PCB surface and increase the ion concentration of the water film on the PCB, which further degrades the insulation of the PCB based on electrochemical migration (ECM). This paper investigates the insulation failure mechanism of immersion silver (ImAg) finished PCB under sodium chloride (NaCl) solution. A Y-pattern PCB was adopted to simulate the ECM failure of the PCB under different concentrations of NaCl solution by water drop tests. Through the on-line monitoring of the surface insulation resistance of PCB, as well as the dendrite morphology and the compositions detection at different reaction stages and different locations between two parallel electrodes, the similarities and differences of the insulation failure characteristics and mechanism of ImAg finished PCB under various concentrations of NaCl solution were analyzed. The effect of chloridion on ECM was discussed by combining the electrochemical theory.
This is a preview of subscription content, log in to check access.
Buy single article
Instant access to the full article PDF.
Price includes VAT for USA
Subscribe to journal
Immediate online access to all issues from 2019. Subscription will auto renew annually.
This is the net price. Taxes to be calculated in checkout.
G.T. Kohman, H.W. Hermance, and G.H. Downes, Bell Syst. Tech. J. 34, 1115 (1955).
K.S. Kim, J.O. Bang, and S.B. Jung, Curr. Appl. Phys. 13, S190 (2013).
K. K. Ding, X.G. Li, and K. Xiao, Trans. Nonferrous Met. Soc. China (English Edition).25, 2446(2015).
M. Pourbaix and J.A. Franklin, Science 154, 1537 (1966).
Y.L. Zhou, P. Yang, C.M Yuan, and Y.J. Huo, in 4th IEEE Conference on Prognostics and System Health Management Proceedings(2013), pp.559-564.
K. Rendl, V. Wirth, and F. Steiner, in 38th International Spring Seminar on Electronics Technology Proceedings (2015), pp.197-201.
B. Medgyes, S. ÁdÁm, L. Tar, V. Verdingovas, R. Ambat, and G. HarsÁnyi, in 40th International Spring Seminar on Electronics Technology Proceedings (ISSE) (2017), pp.1-6.
B. Medgyes, J. Mater. Sci.: Mater. Electron. 28, 18578 (2017).
B.I. Noh and S.B. Jung, J. Mater. Sci.: Mater. Electron. 19, 952 (2008).
D. Minzari, M.S. Jellesen, P. Møller, P. Wahlberg, and R. Ambat, IEEE Trans. Device Mater. Reliab. 9, 392 (2009).
G.Q. Lu, C. Yan, Y. Mei, and X. Li, Mater. Chem. Phys. 151, 18 (2015).
China environmental monitoring general station, National urban air quality status report in January 2019, http://www.cnemc.cn/jcbg/kqzlzkbg/201903/t20190328_697744.shtml. Accessed 38 March 2019.
J.G. Zhang, in 53rd ieee Holm Conference on IEEE Proceedings (2007), pp.16-19.
W.C. Lv and Y.L. Zhou, Electromechanical Components. 28, 19 (2008).
Y.L. Zhou and F.D. Lan, Trans. Electrotechnical Soc. 31, 114 (2016).
Y.L. Zhou and X.X. Wei, Trans. Electrotechnical Soc. 30, 163 (2015).
B. Song, M.H. Azarian, and M.G. Pecht, J. Electrochem. Soc. 160, C97 (2013).
Y.L. Zhou, Y. Li, Y.Y. Chen, and M. Zhu, IEEE Trans. Device Mater. Reliab. (2019). https://doi.org/10.1109/TDMR.2019.2938010.
A. Caputo, L.J. Turbini, and D.D. Perovic, J. Electron. Mater. 39, 92 (2010).
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
About this article
Cite this article
Zhou, Y., Li, Y. & Chen, Y. Insulation Failure Mechanism of Immersion Silver Finished Printed Circuit Board Under NaCl Solution. Journal of Elec Materi 49, 2066–2075 (2020). https://doi.org/10.1007/s11664-019-07885-1
- Electrochemical migration
- NaCl solution
- immersion silver finish
- printed circuit board
- water drop test