Analysis of Kinetic and Nucleation Mechanisms of Electrodeposited Copper on Indium Tin Oxide Thin Films
In this paper, we report an electrochemical study using cyclic voltammetry and chronoamperometry on the kinetic and nucleation mechanisms of electrodeposited copper on indium-doped tin oxide-coated glass substrates from sulfate solutions. The present investigation has been carried out in an acid solution at pH = 5. The Scharifker–Hills model was used to analyze current transients. At relatively low overpotentials, copper deposition is observed to follow a model that involves instantaneous nucleation and diffusion-controlled 3D growth. The diffusion coefficient for Cu2+ for various applied potentials is determined. Atomic force microscopy (AFM) has been used to check the surface morphology of the electrodeposited thin films.
KeywordsIndium tin oxide copper thin films electrodeposition nucleation AFM
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