Decomposed Copper(II) Acetate Over Expanded Graphite (EG) as Hybrid Filler to Fabricate Epoxy Based Thermal Interface Materials (TIMs)

  • Sagar Kumar NayakEmail author
  • Smita Mohanty
  • Sanjay K. Nayak
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder
Part of the following topical collections:
  1. TMS2019 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder


In this investigation, the fabrication of thermal conductive epoxy composite with the assimilation of synthesized expanded graphite (EG) decorated with copper compound nanoparticles [copper (Cu), copper(II) oxide (CuO) and copper(I) oxide (Cu2O) nanoparticles], has been reported wherein, Cu-compound was attached to EG surface by solid-state pyrolysis of copper(II) acetate (CA) monohydrate. The prepared hybrid filler was characterized by an x-ray diffraction technique and the Cu-compound nanoparticles size was 40.8 ± 17.67 nm. The microstructure and morphology of the distributed Cu-compound nanoparticles over the EG surface were characterized by transmission electron microscopy (TEM) and scanning electron microscopy. The Cu-compound nanoparticles decorated EG hybrid filler at 10 wt.% loading ((EG-CA (4)/Ep)10) demonstrated the thermal conductivity (TC) which is 11.8 times higher than the neat epoxy due to the formation 3D percolation heat-conducting networks. Further, decoration of Cu-compound on the EG surface resulted in higher TC as measured using a guarded heat flow meter technique. Lap shear strength of (EG-CA (4)/Ep)10 composite was tuned to 5.93 ± 0.27 MPa as characterized by a universal testing machine. The porosity of fabricated composites was decreased as Cu-compound attachment increases on the EG substrate. The thermo-gravimetric analysis revealed enhanced thermal stability of (EG-CA (4)/Ep)10 composite to 407°C at 50% weight loss consideration. The electrical resistivity of the composite was reduced with the addition of the EG filler system as confirmed from the super megaohmmeter.


Hybrid composites thermal conductivity (TC) expanded graphite (EG) copper compound nanoparticles epoxy matrix 


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Copyright information

© The Minerals, Metals & Materials Society 2019

Authors and Affiliations

  1. 1.SARP-Laboratory for Advanced Research in Polymeric MaterialsCentral Institute of Plastics Engineering and TechnologyBhubaneswarIndia

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