Journal of Electronic Materials

, Volume 48, Issue 2, pp 799–805 | Cite as

Modelling of Freestanding Membrane-Supported Superconducting Al/Ti Bilayer Transition Edge Sensor Bolometer

  • Kamal Ahmad
  • Jie Liu
  • Gang Li
  • Jianshe Liu
  • Wei Chen


The aim of this research work was to model the behaviour of a transition edge sensor (TES) bolometer by applying curve fitting methodology on empirical data. Data obtained from the experiments were used to plot characteristic curves to find resistance–temperature (R–T) and current–voltage (I–V) relations. The measurements were taken by using a cryogenic-free 3He refrigerator with a least temperature of 320 mK. Least-squares curve fitting technique was used to devise the equations of the experimentally obtained data. Similarly, the empirical data and estimated curves were validated using the parameters of R-squared, sum of squares due to error (SSE), adjusted R-squared, and root-mean-squared error (RMSE). By comparing the plot of the empirical data and estimated behaviour curves showed high degree of similarity, and hence it was established that these equations could be used to estimate the bolometer’s operating behaviour for different ambient conditions with minimal percentage error. We also studied etched (TES device suspended on SiN) and non-etched (Si substrate based device) samples of bolometers. It was concluded that bolometers made up of etched sample of TES are appropriate for use in millimetre and submillimeter waves, especially for cosmic microwave background polarization detection.


Transition edge sensor bolometer SQUID sum of squared error (SSE) R-squared R-squared error 


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The National Natural Science Foundation of China supported this work. The State Key Program supports the project for Basic Research of China.


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Copyright information

© The Minerals, Metals & Materials Society 2018

Authors and Affiliations

  1. 1.Tsinghua National Laboratory for Information Science and Technology, Department of Microelectronics and Nanoelectronics, Institute of MicroelectronicsTsinghua UniversityBeijingChina

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