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Journal of Electronic Materials

, Volume 47, Issue 1, pp 430–435 | Cite as

Cu-Sn Intermetallic Compound Joints for High-Temperature Power Electronics Applications

  • Byung-Suk Lee
  • Jeong-Won YoonEmail author
Article

Abstract

Cu-Sn solid–liquid interdiffusion (SLID) bonded joints were fabricated using a Sn-Cu solder paste and Cu for high-temperature power electronics applications. The interfacial reaction behaviors and the mechanical properties of Cu6Sn5 and Cu3Sn SLID-bonded joints were compared. The intermetallic compounds formed at the interfaces in the Cu-Sn SLID-bonded joints significantly affected the die shear strength of the joint. In terms of thermal and mechanical properties, the Cu3Sn SLID-bonded joint was superior to the conventional solder and the Cu6Sn5 SLID-bonded joints.

Keywords

Power electronics soldering intermetallic compounds lead-free solder interface structure 

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Copyright information

© The Minerals, Metals & Materials Society 2017

Authors and Affiliations

  1. 1.Welding and Joining R&D GroupKorea Institute of Industrial Technology (KITECH)IncheonKorea
  2. 2.Critical Materials and Semiconductor Packaging EngineeringUniversity of Science and Technology (UST)DaejeonKorea

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