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Finite Element-Assisted Assessment of the Thermo-cyclic Characteristics of Leads Soldered with SnAgCu(+Bi,In) Alloys

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Abstract

Solder joints between leads and printed circuit boards in thin small outline packages were produced with conventional Sn1.0Ag0.7Cu (SAC107) and Sn3.0Ag0.7Cu (SAC305) solders as well as various solder alloys with gradually increasing amounts of Bi (up to 3.0 wt.%) and In (up to 1.0 wt.%) within the SAC107 base solder. The reliability of soldered leads in temperature cycle (TC) tests improved most with solder alloys containing both Bi (1.6 wt.%) and In (0.5 wt.%). Microindentation and electron probe microanalysis mappings revealed that the effect originates from a combination of solution and precipitation strengthening of the initial SAC alloy. The distribution of inelastic strain accumulation (ISA), as a measure for degradation, was determined in the solder joints by finite element calculations. It was shown that defects in the solder proximal to the lead (<60–75 μm) strongly impact the reliability and provoke crack initiation around the defect where the highest ISA is located. In particular, similar TC performance can be expected for defect-free joints and for those whose defects exceed the threshold distance from the lead (>60–75 μm), which was underpinned by similar cracking characteristics along the lead–solder interface. The ISA was confirmed to be lower in SAC+Bi/In alloys owing to their enhanced elasto-plastic properties. Moreover, the addition of a thin Cu coating on the leads could improve the joint reliability, as suggested by the calculation of the ISA and the acceleration factor.

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Acknowledgements

This work was partially supported by the Council for Science, Technology and Innovation (CSTI), Cross-ministerial Strategic Innovation Promotion Program (SIP), “Structural Materials for Innovation” (Funding agency: JST).

Conflict of interest

The authors declare that they have no conflict of interest.

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Authors and Affiliations

  1. Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University, 2-1 Yamada-oka, Suita, 565-0871, Japan

    Adrian Lis, Kohei Nakanishi, Tomoki Matsuda, Tomokazu Sano & Akio Hirose

  2. Center for Technology Innovation-Production Engineering, Research and Development Group, Hitachi Ltd., 292 Yoshida-cho, Totsuka-ku, Yokohama, 244-0817, Japan

    Madoka Minagawa & Masahide Okamoto

Authors
  1. Adrian Lis
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  2. Kohei Nakanishi
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  3. Tomoki Matsuda
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  4. Tomokazu Sano
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  5. Madoka Minagawa
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  6. Masahide Okamoto
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  7. Akio Hirose
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Correspondence to Adrian Lis.

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Lis, A., Nakanishi, K., Matsuda, T. et al. Finite Element-Assisted Assessment of the Thermo-cyclic Characteristics of Leads Soldered with SnAgCu(+Bi,In) Alloys. J. Electron. Mater. 46, 4326–4343 (2017). https://doi.org/10.1007/s11664-017-5384-1

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  • DOI: https://doi.org/10.1007/s11664-017-5384-1

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