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Journal of Electronic Materials

, Volume 45, Issue 8, pp 4390–4399 | Cite as

Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength

  • Ali RoshanghiasEmail author
  • Golta Khatibi
  • Andriy Yakymovych
  • Johannes Bernardi
  • Herbert IpserEmail author
Open Access
Article

Abstract

Although considerable research has been dedicated to the synthesis and characterization of lead-free nanoparticle solder alloys, only very little has been reported on the reliability of the respective joints. In fact, the merit of nanoparticle solders with depressed melting temperatures close to the Sn-Pb eutectic temperature has always been challenged when compared with conventional solder joints, especially in terms of inferior solderability due to the oxide shell commonly present on the nanoparticles, as well as due to compatibility problems with common fluxing agents. Correspondingly, in the current study, Sn-Ag-Cu (SAC) nanoparticle alloys were combined with a proper fluxing vehicle to produce prototype nanosolder pastes. The reliability of the solder joints was successively investigated by means of electron microscopy and mechanical tests. As a result, the optimized condition for employing nanoparticles as a competent nanopaste and a novel procedure for surface treatment of the SAC nanoparticles to diminish the oxide shell prior to soldering are being proposed.

Keywords

Nanosolders nanojoints Pb-free solders nanoparticles SAC 

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Copyright information

© The Author(s) 2016

Open AccessThis article is distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made.

Authors and Affiliations

  1. 1.Department of Inorganic Chemistry (Materials Chemistry)University of ViennaViennaAustria
  2. 2.Faculty of Technical ChemistryVienna University of TechnologyViennaAustria
  3. 3.USTEMVienna University of TechnologyViennaAustria

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