Abstract
A comparative study of deposition rate, adhesion, structural and electrical properties of nanocrystalline copper thin films deposited using direct current magnetron sputtering (DCMS) and different regimes of high power pulsed magnetron sputtering is presented. High-power impulse magnetron sputtering (HIPIMS) and burst regime (pulse packages) of magnetron sputtering are investigated. The ion and atomic flows toward the growing film during magnetron sputtering of a Cu target are determined. X-ray diffraction, scanning electron microscopy and atomic force microscopy were used to observe the structural characterization of the films. The resistivity of the films was measured using four-point probe technique. In all sputtering regimes, Cu films have mixture crystalline orientations of [111], [200], [311] and [220] in the direction of the film growth. As peak power density in studied deposition regimes was different in order of magnitude (from 15 W/cm2 in DC regime to 3700 W/cm2 in HIPIMS), film properties were also greatly different. DCMS Cu films exhibit a porous columnar grain structure. In contrast, HIPIMS Cu films have a slightly columnar and denser composition. Cu films deposited using burst regimes at peak power density of 415 W cm−2 and ion-to-atom ratio of about 5 have the densest composition and smallest electrical resistance.
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L.J. Lin, N. Zhang, W.D. Sproul, and J.J. Moore, Surf. Coat. Technol. 206, 3283 (2012).
V. Kouznetsov, K. Macák, J.M. Schneider, U. Helmersson, and I. Petrov, Surf. Coat. Technol. 122, 290 (1999).
S.P. Bugaev, N.N. Koval, N.S. Sochugov, and A.N. Zakharov, in 17th International Symposium ISDEIV (1996). doi:10.1109/DEIV.1996.545530
E. Oks and A. Anders, Rev. Sci. Instrum. 81, 02B306 (2010).
A.N. Odivanova, N.S. Sochugov, K.V. Oskomov, and V.G. Podkovyrov, Plasma Phys. Rep. 37, 239 (2011). doi:10.1134/S1063780X1101003X.
D.J. Christie, J. Vac. Sci. Technol. A 23, 330 (2005).
U. Helmersson, M. Lattemann, J. Bohlmark, A.P. Ehiasarian, and J.T. Gudmundsson, Thin Solid Films 513, 1 (2006).
R. Bandorf, A. Bloche, K. Ortner, H. Lüthje, and T. Jung, Plasma Process. Polym. 4, 129 (2007).
R. Bandorf, V. Sittinger, and G. Bräuer, Comprehensive Materials Processing, ed. S.H.F.B.J.V.T. Yilbas (Oxford: Elsevier, 2014), p. 75.
R. Chistyakov and B. Abraham, in 49th Annual SVC Technical Conference (2006).
J. Lin, W.D. Sproul, J.J. Moore, Z. Wu, S. Lee, R. Chistyakov, and B. Abraham, JOM 63, 48 (2011).
O. Antonin, V. Tiron, C. Costin, G. Popa, and T.M. Minea, J. Phys. D 48, 015202 (2015).
J. Sarkar, Sputtering Materials for VLSI and Thin Film Devices (Oxford: Elsevier 2014). doi:10.1016/B978-0-8155- 1593-7.00002-3.
Z.H. Cao, H.M. Lu, and X.K. Meng, Mater. Chem. Phys. 117, 321 (2009).
A.K. Sikder, A. Kumar, P. Shukla, P.B. Zantye, and M. Sanganaria, J. Electron. Mater. 32, 1028 (2003).
I.I. Beilis, Y. Koulik, and R.L. Boxman, Surf. Coat. Technol. 258, 908 (2014).
T. Duguet, F. Senocq, L. Laffont, and C. Vahlas, Surf. Coat. Technol. 230, 254 (2013).
P.J. Lin and M.C. Chen, J. Electron. Mater. 28, 567 (1999).
X. Zhang, A. Misra, H. Wang, T.D. Shen, J.G. Swadener, J.D. Embury, H. Kung, R.G. Hoagland, and M. Nastasi, J. Mater. Res. 18, 1600 (2003).
C. Engström, T. Berlind, J. Birch, L. Hultman, I.P. Ivanov, S.R. Kirkpatrick, and S. Rohde, Vacuum 56, 107 (2000).
A. Anders, Surf. Coat. Technol. 205, 171 (2011).
K.E. Cooke, A. Goodyear, J. Hampshire, and D.G. Teer, Surf. Coat. Technol. 188–189, 750 (2004).
S. Mahieu, K. Van Aeken, and D. Depla, J. Appl. Phys. 104, 113301 (2008).
A. Kramida, Yu. Ralchenko, and J. Reader, NIST ASD Team, NIST Atomic Spectra Database (ver. 5.3) (2015). http://physics.nist.gov/asd, Accessed 28 Jan 2016.
B.-J. Lee, J.-H. Shim, and M. Baskes, Phys. Rev. B 68, 144112 (2003).
S.K. Mukherjee, L. Joshi, and P.K. Barhai, Surf. Coat. Technol. 205, 4582 (2011).
D.W. Hoffman and J.A. Thornton, J. Vac. Sci. Technol. 17, 380 (1980).
M. Mausbach, Surf. Coat. Technol. 74–75, 264 (1995).
G.C.A.M. Janssen and J.-D. Kamminga, Appl. Phys. Lett. 85, 3086 (2004).
P. Ziemann and E. Kay, J. Vac. Sci. Technol. A 1, 512 (1983).
A.P. Ehiasarian, P.E. Hovsepian, L. Hultman, and U. Helmersson, Thin Solid Films 457, 270 (2004).
A.S. Dzhumaliev, YuV Nikulin, and YuA Filimonov, Tech. Phys. 59, 1097 (2014).
L. Huang, F. Liu, and X.G. Gong, Phys. Rev. B 70, 155320 (2004).
K.L. Chopra, Thin Film Phenomena. (Huntington: Krieger, 1979).
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Solovyev, A.A., Oskirko, V.O., Semenov, V.A. et al. Comparative Study of Cu Films Prepared by DC, High-Power Pulsed and Burst Magnetron Sputtering. J. Electron. Mater. 45, 4052–4060 (2016). https://doi.org/10.1007/s11664-016-4582-6
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DOI: https://doi.org/10.1007/s11664-016-4582-6