Journal of Electronic Materials

, Volume 43, Issue 3, pp 708–716 | Cite as

3D FEM Simulations of Drop Test Reliability on 3D-WLP: Effects of Solder Reflow Residual Stress and Molding Resin Parameters

  • Soufyane Belhenini
  • Abdellah Tougui
  • Abdelhake Bouchou
  • Ranganathan Mohan
  • Franck Dosseul


Numerous three-dimensional (3D) packaging technologies are currently used for 3D integration. 3D-wafer level package (3D-WLP) appears to be a way to keep increasing the density of the microelectronic components. The reliability of 3D components has to be evaluated on mechanical demonstrators with daisy chains before real production. Numerical modeling is acknowledged as a very efficient tool for design optimization. In this paper, 3D finite-elements calculations are carried out to analyze the effects of molding resin’s mechanical properties and thickness on the 3D component’s dynamic response under drop loading conditions. Residual stress generated by solder reflow is also discussed. The influences of residual stresses on the numerical estimation of the component behavior during drop loading are studied. Solder reflow residual stresses have an impact on solder plastic strain and die equivalent stress calculations. We have compared the result of two numerical drop test models. Stress-free initial conduction is introduced for the first model. Solder reflow residual stresses are considered as the initial condition for the second drop test model. Quantitative and qualitative comparisons are carried out to show the effect of residual stress in drop test calculations. For the effect of molding resin thickness on the component behavior under drop loading, the stress-free initial condition is considered. The effect of the molding resin’s thickness on critical area location is discussed. The solder bump maximum plastic shear strain and the silicon die maximum equivalent stress are used as reliability criteria. Numerical submodeling techniques are used to increase calculation accuracy. Numerical results have contributed to the design optimization of the 3D-WLP component.

Key words

3D-WLP design FEM drop test modeling submodeling lead-free solder solder reflow residual stress molding resin 


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  1. 1.
    L. Jian-Qiang and R. Ken, Future Fab Int. 23, 27 (2007).Google Scholar
  2. 2.
    M. Umemoto, K. Tanida, Y. Nemoto, M. Hoshino, K. Kojima, Y. Shirai, and K. Takahashi, Proceedings of the 54th Electronic Components and Technology Conference (ECTC), IEEE (Las Vegas, June 1–4, 2004), pp. 616–623. doi: 10.1109/ECTC.2004.1319402.
  3. 3.
    S. Spiesshoefer, L. Schaper, S. Burkett, G. Vangara, Z. Rahman, and P. Arunasalam, Proceedings of the 54th Electronic Components and Technology Conference (ECTC), IEEE (Las Vegas, June 1–4, 2004), pp. 446–471. doi: 10.1109/ECTC.2004.1319380.
  4. 4.
    C.S. Lee, E.K. Choi, U.B. Kang, M.O. Na, H.C. Kim, H.J. Song, J.S. Lee, M.S. Yoon, J.H. Hwang, T.J. Cho, and S.Y. Kang, Proceedings of the 61st Electronic Components and Technology Conference (ECTC), IEEE (Lake Buena Vista, May31–June3,2011), pp. 291–295. doi: 10.1109/ECTC.2011.5898528.
  5. 5.
    C. Wu, M. Hsieh, and K. Chiang, Microelectron. Eng. 87, 505 (2010). doi: 10.1016/j.mee.2009.08.010.CrossRefGoogle Scholar
  6. 6.
    K. Chen, IEEE Trans. Adv. Packag. 3, 340 (2010). doi: 10.1109/TADVP.2009.2036153.CrossRefGoogle Scholar
  7. 7.
    Y.T. Tong, L. Jing-En, E. Pek, T.L. Chwee, and Z. Zhaowei, Proceedings of the 54th Electronic Components and Technology Conference (ECTC), IEEE (Las Vegas, 2004), pp. 1088–1094. doi: 10.1109/ECTC.2004.1319475.
  8. 8.
    P. Lall, S. Gupte, P. Choudhary, and J. Suhling, Proceedings of the 56th Electronic Components and Technology Conference (ECTC) (San Diego, 30 May–02 June, 2006). doi: 10.1109/ECTC.2006.1645804.
  9. 9.
    P. Lall, D. Pandchagade, Y. Liu, W. Jihnson, and J. Suhling, J. Electron. Packag. 129, 373 (2007). doi: 10.1115/1.2804085.CrossRefGoogle Scholar
  10. 10.
    R. Wei and W. Jianjun, Proceedings of the 5th Electronic Components and Technology Conference (ECTC) (Las Vegas, Dec 10–12, 2003), pp. 217–222. doi: 10.1109/EPTC.2003.1271519.
  11. 11.
    S. BELHENINI, A. Bouchou, F. Dosseul and A. Tougui, Proceedings of the 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (Cascais-Portugal, April 16–18, 2012). doi: 10.1109/ESimE.2012.6191717.
  12. 12.
    C. Le Coq, A. Tougui, M.-P. Stempin, and L. Barreau, Microelectron. Reliab. 51, 1060 (2011). doi: 10.1016/j.microrel.2011.03.011.CrossRefGoogle Scholar
  13. 13.
    H.S. Dhiman, X.J. Fan, and T. Zhou, Proceedings of the 59th Electronic Components and Technology Conference (ECTC), IEEE (San Diego, May 26–29, 2009), pp. 556–564. doi: 10.1109/ECTC.2009.5074068.
  14. 14.
    Y. Chang-Lin and L. Yi-Shao, Microelectron. Reliab. 46, 626 (2006). doi: 10.1016/j.microrel.2004.12.021.CrossRefGoogle Scholar
  15. 15.
    Z. Ma, F. Chalon, R. Leroy, N. Ranganathan, and B. Beake, J. Electron. Mater. (2013). doi: 10.1007/s11664-013-2666-0.Google Scholar
  16. 16.
    S. Hongbin, T. Cuihua, Z. Rui, T.P. Jong, and U. Toshitsugu, Microelectron. Reliab. 52, 1870 (2012).CrossRefGoogle Scholar
  17. 17.
    Y. Liu, F. Kessels, W. Van Driel, J. Van Driel, F. Sun, and G. Zhang, Microelectron. Reliab. 49, 1299 (2009). doi: 10.1016/j.microrel.2009.07.008.CrossRefGoogle Scholar
  18. 18.
    J. Zaal, W. Van Driel, F. Kessels, and G. Zhang, Proceedings of the 58th Electronic Components and Technology Con- ference (ECTC) (May 27–30, 2008, IEEE), pp. 2149–2155. doi: 10.1109/ECTC.2008.4550283.
  19. 19.
    IPC/JEDEC J-STD-020D.1 JOINT INDUSTRY STANDARD, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices, JEDEC Standards, March 2008.Google Scholar

Copyright information

© TMS 2014

Authors and Affiliations

  • Soufyane Belhenini
    • 1
  • Abdellah Tougui
    • 1
  • Abdelhake Bouchou
    • 1
  • Ranganathan Mohan
    • 1
  • Franck Dosseul
    • 2
  1. 1.Laboratoire de Mécanique et Rhéologie LMREPU, université de ToursToursFrance
  2. 2.STMicroelectronicsToursFrance

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